EP4SE530F43C4G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 1,499 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 1120 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4SE530F43C4G – Field Programmable Gate Array (FPGA) IC
The EP4SE530F43C4G is a Field Programmable Gate Array (FPGA) IC from Intel, provided as part of the Stratix IV device family. It combines a high-density programmable fabric with architecture elements described in the Stratix IV Device Handbook to address protocol-rich, high-bandwidth system designs.
With a large logic element count, substantial on‑chip memory, and a high I/O complement in a 1760‑FCBGA package, this device targets applications requiring integration of complex logic, on‑chip buffering, and extensive external connectivity while operating within commercial temperature and voltage ranges.
Key Features
- Core / Logic Approximately 531,200 logic elements for implementing complex control, datapath, and custom hardware acceleration functions.
- Embedded Memory Approximately 28 Mbits of embedded memory to support buffering, frame storage, and LUT-based functions without immediate reliance on external RAM.
- I/O Capacity 1,120 user I/Os to accommodate broad parallel interfaces and multiple external peripherals.
- High‑Speed Architecture Built on the Stratix IV family architecture with high‑speed transceiver features and design intent for high aggregate data bandwidth as documented in the device handbook.
- DSP and Timing Resources Includes dedicated DSP resources, clock networks, and PLLs referenced in the Stratix IV documentation to support synchronous and high‑throughput designs.
- Power Core supply range specified at 870 mV to 930 mV to match system power budgeting and regulator selection.
- Package & Mounting 1760‑FCBGA (42.5 × 42.5 mm) surface‑mount package suitable for dense board layouts.
- Operating Range & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance RoHS compliant.
Typical Applications
- High‑performance networking and switching Use the device’s high logic density, embedded memory, and Stratix IV transceiver features to implement packet processing, switching fabrics, and protocol handling.
- Telecommunications and transport Leverage the family’s high‑speed transceiver architecture and abundant I/O for protocol conversion, framing, and line interfaces.
- Digital signal processing Employ on‑chip DSP resources and approximately 28 Mbits of embedded memory for baseband processing, filtering, and real‑time signal operations.
- Board‑level system integration and prototyping Large logic element count and 1,120 I/Os enable integration of multiple subsystems and rapid hardware validation on a single FPGA.
Unique Advantages
- High logic capacity: Approximately 531,200 logic elements allow consolidation of multiple functions into a single device, reducing inter‑chip routing and BOM complexity.
- Substantial on‑chip memory: Approximately 28 Mbits of embedded memory helps minimize external memory dependence for buffering and state storage.
- Extensive I/O connectivity: 1,120 I/Os provide flexibility for parallel buses, memory interfaces, and peripheral attachments.
- Architecture oriented to bandwidth: Stratix IV family design emphasis on high‑speed transceivers and aggregate bandwidth supports data‑intensive applications.
- Compact, serviceable package: 1760‑FCBGA (42.5×42.5 mm) surface‑mount form factor supports dense PCB layouts while providing the pin count required for complex systems.
- Commercial readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
Why Choose EP4SE530F43C4G?
The EP4SE530F43C4G is positioned for designs that require substantial programmable logic, on‑chip memory, and a high I/O count within the Stratix IV architectural family. It is suitable for engineers building protocol‑rich, high‑bandwidth systems where integration and on‑chip resources reduce board complexity.
Backed by the Stratix IV device documentation, the EP4SE530F43C4G offers a documented platform for scaling designs and leveraging the device family's clocking, DSP, and transceiver capabilities while operating within commercial-grade temperature and standard RoHS environmental compliance.
Request a quote or submit an inquiry for pricing and availability of EP4SE530F43C4G to evaluate suitability for your next high‑performance FPGA design.

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