EP4SE530F43I4

The EP4SE530F43I4 is a Stratix IV E field programmable gate array (FPGA) from Intel, delivered in a 1760‑ball FCBGA package. It provides high logic density and substantial on‑chip memory to support complex digital designs that require large-scale logic integration and extensive embedded RAM.

With 531,200 logic elements, approximately 28 Mbits of embedded memory, and 1,120 I/O pins, this industrial‑grade device addresses applications that demand high I/O bandwidth, dense logic resources, and robust thermal tolerance.

Key Features

• Core Logic  531,200 logic elements for implementing large, complex digital systems and custom hardware accelerators.
• Embedded Memory  Approximately 28 Mbits of on‑chip RAM to store large datasets, buffering, and state within the FPGA fabric.
• I/O Density  1,120 user I/O pins to support wide parallel interfaces, multi‑lane connections, and extensive peripheral integration.
• Transceivers and High‑Speed Peripherals  Device documentation includes transceiver performance and datapath specifications, enabling high‑speed serial connectivity and protocol implementation.
• DSP and TriMatrix Memory Blocks  Dedicated DSP block and TriMatrix memory block specifications are included for signal processing and structured memory needs.
• Clocking and PLLs  Integrated clock tree and PLL specifications for flexible clock management and timing control across the device.
• Configuration and Test  Built‑in configuration and JTAG support documented for programming, debugging, and device management.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet demanding environmental conditions.
• Low‑Voltage Core  Core supply voltage specified from 870 mV to 930 mV for efficient power delivery to the FPGA core.
• Package and Mounting  1760‑ball FCBGA (1760‑BBGA) package, 42.5 × 42.5 mm footprint; surface‑mount mounting type for dense board integration.
• RoHS Compliant  Device is RoHS compliant.

Typical Applications

• High‑Density Signal Processing  Implements large FPGA‑based datapaths and DSP algorithms using abundant logic elements and DSP resources.
• Multi‑lane Communication Systems  Supports high‑speed serial transceivers and wide I/O arrays for packet processing, backplane interfaces, and protocol bridging.
• Embedded Memory‑Intensive Designs  Leverages approximately 28 Mbits of on‑chip RAM for buffering, lookup tables, and local data storage to reduce external memory dependence.
• Industrial Control and Automation  Wide operating temperature range and high I/O count enable control, monitoring, and interfacing in industrial systems.

Unique Advantages

• High Logic Capacity: 531,200 logic elements provide the headroom necessary for large FPGA designs and complex custom logic integration.
• Substantial On‑Chip Memory: Approximately 28 Mbits of embedded RAM reduces reliance on external memory and improves data locality for performance‑sensitive tasks.
• Broad I/O Resource: 1,120 I/O pins support dense peripheral connectivity and parallel data paths, simplifying board design for complex systems.
• Industrial‑Grade Temperature Tolerance: −40 °C to 100 °C operating range supports deployment in elevated or variable temperature environments.
• Comprehensive On‑Die Support Blocks: Integrated transceivers, PLLs, DSP blocks, and TriMatrix memory block documentation enable targeted use of hardened resources.
• Compact High‑Density Package: 1760‑ball FCBGA (42.5 × 42.5 mm) combines large resource counts with a compact board footprint for space‑constrained designs.

Why Choose EP4SE530F43I4?

The EP4SE530F43I4 delivers a balanced combination of high logic density, significant embedded memory, and extensive I/O in an industrial‑grade Stratix IV E FPGA. Its documented transceiver, PLL, DSP, and memory block capabilities enable implementation of complex signal processing, communication, and control systems while keeping critical resources on‑chip.

This part is well suited to engineers and procurement teams building large FPGA systems that require robust thermal margins, high I/O count, and consolidated logic and memory resources—offering scalability and reliable operation backed by Intel’s Stratix IV device documentation.

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