EP4SE530H35C2G

IC FPGA 744 I/O 1152HBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 392 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-HBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits28033024

Overview of EP4SE530H35C2G – Field Programmable Gate Array (FPGA) IC

The EP4SE530H35C2G is a high-density FPGA device built on the Stratix IV device family architecture. It delivers a large programmable fabric with extensive on-chip memory and I/O to support high-throughput, logic‑intensive designs.

This device targets applications that require substantial logic capacity, on-chip memory, and broad I/O connectivity. Its combination of 531,200 logic elements, approximately 28 Mbits of embedded memory, and 744 I/O pins supports complex signal processing, protocol bridging, and high-bandwidth system functions.

Key Features

  • Core Logic  531,200 logic elements provide a large programmable fabric for implementing complex algorithms, state machines, and custom accelerators.
  • Embedded Memory  Approximately 28 Mbits of on-chip RAM for buffering, frame storage, and intermediate data processing close to logic.
  • I/O and Packaging  744 user I/O pins in a 1152-ball HBGA FCBGA package (42.5 × 42.5 mm) enable dense external interfacing and system routing.
  • Stratix IV Architecture  Device handbook documents architecture features including clock networks, PLLs, DSP blocks, and high-speed transceiver support for protocol and bandwidth flexibility.
  • Power  Core supply range specified from 870 mV to 930 mV to meet system power-rail requirements for the device core.
  • Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C, suitable for standard commercial applications.
  • Regulatory  RoHS compliant for lead-free assembly and environmental compliance.

Typical Applications

  • High-Speed Data Interfaces  Implement protocol bridging, packet processing, or custom transceiver logic using the Stratix IV architecture and extensive I/O.
  • Signal Processing & Acceleration  Deploy DSP blocks and the large logic fabric for video, communications, or algorithmic acceleration where on-chip memory reduces external bandwidth needs.
  • Prototyping & System Integration  Use the device for development platforms and system prototypes that require high logic density and broad external connectivity.
  • Test & Measurement  Build custom acquisition, preprocessing, or real-time analysis functions leveraging the device’s memory and logic resources.

Unique Advantages

  • Large Logic Capacity: 531,200 logic elements give designers the room to implement complex, multi-function systems on a single device.
  • Substantial On-Chip Memory: Approximately 28 Mbits of embedded RAM reduce reliance on external memory for many buffering and processing tasks.
  • Extensive I/O Count: 744 I/O pins in a high-density 1152-ball package simplify connectivity to DDR, SERDES PHYs, sensors, and external peripherals.
  • Stratix IV Feature Set: Architecture features documented in the device handbook—such as clock networks, PLLs, DSP resources, and high-speed transceiver support—help implement timing-critical and high-bandwidth designs.
  • Commercial Grade & RoHS Compliant: Designed for commercial-temperature environments and lead-free assembly processes.
  • Low-Voltage Core: Core supply specified at 870 mV–930 mV supports low-voltage system designs and power budgeting.

Why Choose EP4SE530H35C2G?

The EP4SE530H35C2G positions itself as a logic- and memory-dense FPGA option within the Stratix IV device family, suitable for designs that demand high logic counts, sizable embedded memory, and broad I/O connectivity. Its documented architecture features—clocking, DSP resources, PLLs, and high-speed transceiver capability—make it appropriate for high-throughput signal processing, protocol implementation, and system integration tasks.

For teams developing complex FPGA-based systems that require scalable logic resources, generous on-chip RAM, and a high pin-count package, the EP4SE530H35C2G offers a platform that balances integration and system-level flexibility while adhering to commercial temperature and RoHS requirements.

Request a quote or submit a pricing and availability inquiry for EP4SE530H35C2G today to evaluate it for your next high-density FPGA design.

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