EP4SE530H35C2

The EP4SE530H35C2 is a Stratix® IV E Field Programmable Gate Array (FPGA) IC from Intel, supplied in a high-density FCBGA/HBGA package. It provides very large on-chip logic and memory capacity together with extensive I/O resources, making it suitable for designs that require significant programmable logic, embedded memory, and multi-pin interfacing.

Key Features

• Logic Capacity — Approximately 531,200 logic elements to implement large-scale digital logic and complex finite-state machines within a single device.
• Embedded Memory — Approximately 28 Mbits of on-chip RAM for buffering, lookup tables, and data storage close to logic functions.
• I/O Count — Up to 744 I/O pins to support extensive device and board-level interfacing requirements.
• Package — 1152-BBGA, FCBGA package; supplier lists 1152-HBGA with a 42.5 × 42.5 mm footprint for compact, high-density board designs.
• Power Supply — Rated supply range of 870 mV to 930 mV, suitable for designs targeting this core-voltage domain.
• Mounting & Grade — Surface-mount device with commercial grade operation for standard embedded and consumer system integration.
• Operating Temperature — Rated for 0 °C to 85 °C ambient operation.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density digital systems — Use the device’s ~531,200 logic elements to consolidate complex logic functions into a single FPGA.
• Memory-intensive designs — Leverage approximately 28 Mbits of embedded RAM for buffering, packet processing, or lookup tables close to processing logic.
• I/O-heavy interfaces — Employ up to 744 I/Os to connect multiple peripherals, serializers/deserializers, or parallel interfaces on a single board.

Unique Advantages

• High logic density: Approximately 531,200 logic elements enable large designs to be implemented on one device, reducing design partitioning.
• Substantial embedded memory: Approximately 28 Mbits of on-chip RAM supports data buffering and local storage without immediate external memory dependency.
• Extensive I/O resources: 744 I/Os provide flexibility for complex system interfacing and multi-channel connectivity.
• Compact, high-ball-count package: 1152-ball FCBGA/HBGA (42.5 × 42.5 mm supplier footprint) offers a space-efficient platform for high-pin-count designs.
• Commercial temperature range: Rated 0 °C to 85 °C for mainstream embedded and consumer applications.
• Regulatory compliance: RoHS compliant to meet common environmental directives.

Why Choose EP4SE530H35C2?

The EP4SE530H35C2 positions itself as a high-capacity Stratix IV E FPGA option for engineers who need substantial programmable logic, embedded memory, and a broad set of I/O within a compact BGA footprint. Its combination of roughly 531,200 logic elements, ~28 Mbits of on-chip RAM, and up to 744 I/Os makes it well suited to consolidate complex digital functions and memory-intensive blocks into a single device while maintaining a commercial-grade operating profile.

This device is appropriate for projects where integration density, abundant on-chip resources, and a high ball-count package are key selection criteria. Its electrical and packaging details—870 mV–930 mV supply range, surface-mount FCBGA/HBGA packaging, and RoHS compliance—help ensure compatibility with standard board-level power domains and assembly processes.

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