EP4SE530H35C3

The EP4SE530H35C3 is a Stratix IV E family field-programmable gate array (FPGA) in a 1152‑BBGA / FCBGA package. It delivers a high logic capacity device architecture tailored for designs that require large on-chip resources, substantial I/O, and flexible system integration.

With 531,200 logic elements, approximately 28 Mbits of embedded memory and 744 I/Os, this device targets high-density digital processing, communications interfaces and complex system integration where performance, integration and I/O count drive board-level design choices.

Key Features

• Core logic density — 531,200 logic elements provide a large fabric for custom logic, complex state machines and parallel processing implementations.
• Embedded memory — Total on-chip RAM of 28,033,024 bits (approximately 28 Mbits) supports wide internal buffering, frame storage and high-throughput data paths.
• High I/O count — 744 I/Os allow extensive external device interfacing and multi-channel system connectivity.
• FPGA family architecture — Stratix IV E device features referenced in the device handbook include embedded memory, DSP blocks, PLLs, clock networks and high-speed differential I/O capabilities for protocol and interface flexibility.
• Supply voltage — Core supply 870 mV–930 mV for compatibility with targeted power-rail designs and regulator selection.
• Package and mounting — Surface-mount 1152‑BBGA, FCBGA package; supplier device package listed as 1152‑HBGA with a 42.5 × 42.5 mm footprint for PCB footprint and thermal planning.
• Commercial grade temperature — Rated for 0 °C to 85 °C operating range for standard commercial applications.
• RoHS compliant — Conforms to RoHS requirements for lead-free manufacturing and assembly processes.

Typical Applications

• High-performance communications — Use the device’s large logic and I/O resources to implement packet processing, protocol bridging and interface aggregation.
• Digital signal processing — Leverage embedded memory and DSP-oriented architecture for signal filtering, FFTs and real-time data pipelines.
• Imaging and video systems — Large on-chip memory and abundant I/O enable frame buffering, parallel image pipelines and multi‑lane video interfaces.
• System integration and prototyping — High logic density and extensive I/O provide a flexible platform for complex SoC prototyping and subsystem integration.

Unique Advantages

• High logic capacity: 531,200 logic elements enable dense, feature-rich designs without immediate partitioning across multiple devices.
• Substantial on-chip memory: Approximately 28 Mbits of embedded RAM reduces external memory dependencies for many buffering and caching needs.
• Extensive I/O resources: 744 I/Os simplify multi-device interfacing and support large connector counts or parallel channel designs.
• Family-level integration: Stratix IV E architecture includes DSP blocks, PLLs and high-speed differential I/O features that support diverse protocol and processing requirements.
• Commercial temperature rating: 0 °C to 85 °C offers suitability for standard commercial product environments and typical electronic assemblies.
• RoHS compliant packaging: Surface-mount 1152‑BBGA / 1152‑HBGA packaging aligns with modern lead‑free manufacturing processes.

Why Choose EP4SE530H35C3?

The EP4SE530H35C3 positions itself as a high-capacity Stratix IV E FPGA option for designs that require substantial logic, on-chip memory and wide I/O availability. Its device-level attributes make it suitable for developers implementing complex digital signal processing, high-throughput communications, and extensive system integration tasks within commercial temperature environments.

Choosing this FPGA provides a pathway to consolidate functionality on a single device, reduce board-level complexity and leverage the Stratix IV E family architecture for designs that demand both resource density and flexible interfacing options.

Request a quote or submit an inquiry to get pricing and availability for EP4SE530H35C3 and discuss how this device can meet your design requirements.