EP4SE530H35C4

The EP4SE530H35C4 is an Intel Stratix IV E FPGA delivering high logic density and on-chip memory in a ball-grid array package. It provides 531,200 logic elements and approximately 28 Mbits of embedded RAM, with 744 user I/O pins, making it suitable for complex, high-throughput digital designs.

Built on the Stratix IV device family architecture, this commercial-grade FPGA supports features highlighted in the device handbook—including DSP blocks, PLLs, high-speed transceiver-capable architecture, and external memory interface support—while operating from a 870 mV to 930 mV core supply and a 0 °C to 85 °C temperature range.

Key Features

• Core Logic — 531,200 logic elements for large-scale combinational and sequential logic implementations.
• Embedded Memory — Approximately 28 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Density — 744 user I/O pins to support wide external interfaces and multi-channel connectivity.
• Family Architecture — Stratix IV E device-family features noted in the handbook, including DSP blocks, PLLs, and high-speed transceiver architecture.
• Package — 1152-BBGA, FCBGA package (supplier device package: 1152-HBGA, 42.5 × 42.5 mm) for a compact, high-pin-count footprint.
• Power — Core supply range of 870 mV to 930 mV to match target power domains.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental — RoHS compliant.

Typical Applications

• High-Speed Communications — Leverage the Stratix IV family’s transceiver-capable architecture and high I/O count to implement protocol engines and packet processing.
• Digital Signal Processing — Large logic capacity and embedded memory support DSP pipelines, filtering, and custom accelerators.
• External Memory Interfaces — Use the device’s memory resources and interface capabilities for controllers and buffering in data-heavy systems.
• Video and Imaging — On-chip RAM and DSP resources enable frame buffering, preprocessing, and real-time image pipelines.
• Test & Measurement — High logic density and abundant I/O allow integration of complex measurement logic and multiple instrument channels.

Unique Advantages

• High integration density: 531,200 logic elements and approximately 28 Mbits of embedded RAM reduce the need for multiple discrete devices.
• Extensive I/O capability: 744 user I/Os support multi-protocol interfaces and high channel counts without external multiplexing.
• Compact, robust packaging: 1152-BBGA / 1152-HBGA footprint delivers high pin count in a space-efficient package.
• Family-level feature set: Documented Stratix IV E features—DSP blocks, PLLs, and high-speed transceiver architecture—provide building blocks for high-performance systems.
• Energy-aware core voltage: 870–930 mV core supply aligns with modern low-voltage power domains.
• Regulatory readiness: RoHS compliance supports environmentally conscious product designs.

Why Choose EP4SE530H35C4?

The EP4SE530H35C4 positions itself for designs that require substantial programmable logic, abundant on-chip memory, and high I/O capacity within a commercial-temperature FPGA. Its specification set is aligned with system-level integration goals where consolidating logic, memory, and interface functions into a single device simplifies board-level design.

Engineers and procurement teams seeking a Stratix IV E family device benefit from the documented family features and Intel’s device handbook guidance, enabling scalable implementations for communication, DSP, imaging, and instrumentation applications.

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