EP4SE530H35C4N
| Part Description |
STRATIX® IV E Field Programmable Gate Array (FPGA) IC 744 28033024 531200 1152-BBGA, FCBGA |
|---|---|
| Quantity | 736 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-HBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 744 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4SE530H35C4N – STRATIX® IV E FPGA, 531,200 logic elements, 744 I/Os
The EP4SE530H35C4N is a Stratix® IV E field programmable gate array (FPGA) device featuring high logic density and substantial embedded RAM. The device integrates 531,200 logic elements, approximately 28 Mbits of on-chip memory, and 744 I/O pins in a 1152-ball BGA (FCBGA) package to support complex, high-density digital designs.
Designed for projects that require abundant logic resources, significant embedded memory, and a large I/O count, the EP4SE530H35C4N is appropriate for designs that benefit from documented device characteristics such as DC and switching specifications, transceiver performance, DSP block details and PLL capabilities as described in the device handbook.
Key Features
- Core Logic 531,200 logic elements provide substantial programmable fabric for large-scale logic implementation and complex system integration.
- Embedded Memory Approximately 28 Mbits of on-chip RAM to support data buffering, lookup tables and embedded storage requirements.
- I/O Capacity 744 I/O pins deliver extensive external connectivity for multi-channel interfaces and high-pin-count systems.
- Package and Mounting Surface-mount 1152-BBGA (FCBGA) package; supplier package specified as 1152-HBGA with a 42.5 × 42.5 mm footprint for board-level integration.
- Power Supply Range Core voltage specified from 870 mV to 930 mV to match system power delivery design and sequencing requirements.
- Operating Range Commercial-grade operating temperature from 0 °C to 85 °C for typical commercial and enterprise environments.
- Standards & Compliance RoHS compliant to meet lead-free and restricted substances requirements.
- Documented Subsystems Device handbook/datasheet includes DC and switching characteristics, PLL specifications, DSP block specifications, transceiver performance, TriMatrix memory block specifications, configuration and JTAG details and other application-relevant technical data.
Typical Applications
- High-density digital systems Large programmable fabric and extensive embedded RAM support complex logic implementations and system integration on a single device.
- High‑I/O interface boards 744 configurable I/Os enable multi-channel connectivity and dense peripheral interfacing for I/O‑intensive designs.
- DSP and signal processing designs On-chip memory and documented DSP block specifications in the device handbook support data‑heavy signal processing implementations.
- Systems requiring PLLs and transceivers Datasheet coverage of PLL and transceiver performance provides the technical baseline for clocking and high-speed serial interface planning.
Unique Advantages
- High logic density: 531,200 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
- Substantial embedded memory: Approximately 28 Mbits of on-chip RAM supports large buffers, FIFOs and lookup tables without external memory in many designs.
- Extensive I/O: 744 I/Os provide flexibility for complex interconnects and high‑pin‑count system architectures.
- Comprehensive technical documentation: Datasheet and device handbook sections covering DC/switching characteristics, PLLs, DSP blocks and transceivers help shorten design validation and system integration effort.
- RoHS compliant: Conforms to lead‑free manufacturing and restricted substances requirements for modern production flows.
- Commercial operating range: Rated for 0 °C to 85 °C to suit commercial and enterprise deployment environments.
Why Choose EP4SE530H35C4N?
The EP4SE530H35C4N positions itself as a high-density Stratix IV E FPGA targeted at designs that require a large amount of programmable logic, significant embedded memory and a high I/O count. With documented device characteristics including DC and switching specs, PLL, DSP and transceiver information in the device handbook, engineers can base design decisions on verifiable technical details.
This device is suited to customers developing complex digital systems, I/O‑rich boards and signal processing applications who need a scalable, well-documented FPGA platform with commercial-grade temperature support and RoHS compliance.
Request a quote or submit an inquiry to check pricing and availability for EP4SE530H35C4N. Our team can provide lead-time and procurement details to support your design schedule.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018