EP4SE530H35C4N

IC FPGA 744 I/O 1152HBGA
Part Description

STRATIX® IV E Field Programmable Gate Array (FPGA) IC 744 28033024 531200 1152-BBGA, FCBGA

Quantity 736 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-HBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28033024

Overview of EP4SE530H35C4N – STRATIX® IV E FPGA, 531,200 logic elements, 744 I/Os

The EP4SE530H35C4N is a Stratix® IV E field programmable gate array (FPGA) device featuring high logic density and substantial embedded RAM. The device integrates 531,200 logic elements, approximately 28 Mbits of on-chip memory, and 744 I/O pins in a 1152-ball BGA (FCBGA) package to support complex, high-density digital designs.

Designed for projects that require abundant logic resources, significant embedded memory, and a large I/O count, the EP4SE530H35C4N is appropriate for designs that benefit from documented device characteristics such as DC and switching specifications, transceiver performance, DSP block details and PLL capabilities as described in the device handbook.

Key Features

  • Core Logic  531,200 logic elements provide substantial programmable fabric for large-scale logic implementation and complex system integration.
  • Embedded Memory  Approximately 28 Mbits of on-chip RAM to support data buffering, lookup tables and embedded storage requirements.
  • I/O Capacity  744 I/O pins deliver extensive external connectivity for multi-channel interfaces and high-pin-count systems.
  • Package and Mounting  Surface-mount 1152-BBGA (FCBGA) package; supplier package specified as 1152-HBGA with a 42.5 × 42.5 mm footprint for board-level integration.
  • Power Supply Range  Core voltage specified from 870 mV to 930 mV to match system power delivery design and sequencing requirements.
  • Operating Range  Commercial-grade operating temperature from 0 °C to 85 °C for typical commercial and enterprise environments.
  • Standards & Compliance  RoHS compliant to meet lead-free and restricted substances requirements.
  • Documented Subsystems  Device handbook/datasheet includes DC and switching characteristics, PLL specifications, DSP block specifications, transceiver performance, TriMatrix memory block specifications, configuration and JTAG details and other application-relevant technical data.

Typical Applications

  • High-density digital systems  Large programmable fabric and extensive embedded RAM support complex logic implementations and system integration on a single device.
  • High‑I/O interface boards  744 configurable I/Os enable multi-channel connectivity and dense peripheral interfacing for I/O‑intensive designs.
  • DSP and signal processing designs  On-chip memory and documented DSP block specifications in the device handbook support data‑heavy signal processing implementations.
  • Systems requiring PLLs and transceivers  Datasheet coverage of PLL and transceiver performance provides the technical baseline for clocking and high-speed serial interface planning.

Unique Advantages

  • High logic density: 531,200 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
  • Substantial embedded memory: Approximately 28 Mbits of on-chip RAM supports large buffers, FIFOs and lookup tables without external memory in many designs.
  • Extensive I/O: 744 I/Os provide flexibility for complex interconnects and high‑pin‑count system architectures.
  • Comprehensive technical documentation: Datasheet and device handbook sections covering DC/switching characteristics, PLLs, DSP blocks and transceivers help shorten design validation and system integration effort.
  • RoHS compliant: Conforms to lead‑free manufacturing and restricted substances requirements for modern production flows.
  • Commercial operating range: Rated for 0 °C to 85 °C to suit commercial and enterprise deployment environments.

Why Choose EP4SE530H35C4N?

The EP4SE530H35C4N positions itself as a high-density Stratix IV E FPGA targeted at designs that require a large amount of programmable logic, significant embedded memory and a high I/O count. With documented device characteristics including DC and switching specs, PLL, DSP and transceiver information in the device handbook, engineers can base design decisions on verifiable technical details.

This device is suited to customers developing complex digital systems, I/O‑rich boards and signal processing applications who need a scalable, well-documented FPGA platform with commercial-grade temperature support and RoHS compliance.

Request a quote or submit an inquiry to check pricing and availability for EP4SE530H35C4N. Our team can provide lead-time and procurement details to support your design schedule.

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