EP4SE530H35I4
| Part Description |
STRATIX® IV E Field Programmable Gate Array (FPGA) IC 744 28033024 531200 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,389 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-HBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 744 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4SE530H35I4 – STRATIX® IV E Field Programmable Gate Array (FPGA) IC 744 28033024 531200 1152-BBGA, FCBGA
The EP4SE530H35I4 is a Stratix IV E series FPGA device providing a high-capacity programmable fabric for demanding embedded and industrial designs. It combines a large logic array, substantial on-chip memory, and a broad set of I/O to support complex data processing and interface tasks.
Designed for industrial-grade applications, the device offers 531,200 logic elements, approximately 28 Mbits of embedded memory, and 744 I/O pins in a 1152-ball FCBGA package, delivering the integration needed for high-bandwidth, compute-intensive systems.
Key Features
- High logic capacity — 531,200 logic elements for implementing large digital systems and complex algorithms.
- Significant embedded memory — Approximately 28 Mbits of on-chip RAM to support buffering, frame storage, and intermediate data processing without external memory for many use cases.
- Extensive I/O — 744 user I/Os to accommodate multiple parallel interfaces, external memories, and peripheral connectivity.
- Package — 1152-ball BGA (FCBGA) package; supplier package listed as 1152-HBGA with a 42.5 × 42.5 mm footprint for board-level integration.
- Operating range — Industrial-grade qualification with an operating temperature range of −40 °C to 100 °C for use in demanding environments.
- Low-voltage core — Core supply range specified from 870 mV to 930 mV to match modern low-voltage system rails.
- Family-level capabilities — As a Stratix IV E device, it is part of a family with architecture features including high-speed transceiver support, external memory interfaces, and DSP-oriented resources (as described in the Stratix IV device handbook).
Typical Applications
- High-bandwidth communications — Implement protocol handling and packet processing where large logic capacity and many I/Os are required.
- Signal processing and DSP — Use on-chip memory and the Stratix IV E family’s DSP-oriented architecture for real-time data transformations and filtering.
- External memory interface systems — Act as a bridge or controller for external memory subsystems, leveraging abundant I/O and on-chip RAM for buffering.
- Industrial control and automation — Deploy in industrial environments that require the specified −40 °C to 100 °C temperature range and industrial-grade reliability.
Unique Advantages
- Large programmable fabric: 531,200 logic elements enable integration of multiple subsystems into a single device, reducing board-level component count.
- Substantial embedded memory: Approximately 28 Mbits of on-chip RAM reduces dependency on external memory for many buffering and staging tasks, simplifying system design.
- High pin count for flexible interfacing: 744 I/Os support parallel buses, multiple peripherals, and complex external interface requirements without immediate need for I/O expanders.
- Industrial operating range: Rated for −40 °C to 100 °C to meet temperature requirements for rugged and industrial deployments.
- Compact board integration: 1152-ball FCBGA package with a defined supplier footprint (42.5 × 42.5 mm) helps optimize PCB real estate while supporting high I/O density.
- Low-voltage core compatibility: Core supply range of 870–930 mV facilitates integration into modern low-voltage power architectures.
Why Choose EP4SE530H35I4?
The EP4SE530H35I4 positions itself as a high-capacity, industrial-grade FPGA solution for designs that demand significant logic resources, substantial on-chip memory, and broad I/O capability. Its combination of 531,200 logic elements, approximately 28 Mbits of embedded RAM, and 744 I/Os makes it suitable for complex data-paths, protocol engines, and DSP functions where consolidation and integration reduce system complexity.
Engineers and procurement teams targeting robust, scalable implementations will find this device aligned with applications that require industrial temperature operation, a compact BGA footprint, and low-voltage core compatibility—backed by the Stratix IV E family architecture documented in the device handbook.
Request a quote or submit a purchase inquiry to evaluate the EP4SE530H35I4 for your next project and begin the procurement process for samples and production quantities.

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