EP4SE530H35I3G

The EP4SE530H35I3G is an Intel Stratix IV–family Field Programmable Gate Array (FPGA) IC designed for high-density logic and system integration. It delivers substantial on-chip resources and I/O capacity suitable for demanding communications, signal processing, and industrial control applications.

Built for robustness in industrial environments, the device combines large logic capacity, significant embedded memory, and a broad I/O complement, enabling complex designs that require high integration and flexible system interfacing.

Key Features

• Stratix IV architecture Family-level features include embedded memory, digital signal processing blocks, clock networks and PLLs, and high-speed transceiver support as described in the Stratix IV device handbook.
• High logic capacity 531,200 logic elements provide substantial programmable fabric for large designs and multi-function integration.
• Embedded memory Approximately 28 Mbits of on-chip RAM to support buffering, lookup tables and local data storage.
• Extensive I/O 744 I/O signals to support wide external connectivity and complex board-level interfacing.
• Package and mounting Available in 1152-ball BGA FCBGA package variants, supplier package indicated as 1152-HBGA with a 42.5 × 42.5 mm footprint; surface-mount construction for standard PCB assembly.
• Power Core voltage supply specified from 870 mV to 930 mV, enabling predictable power planning for supply design.
• Industrial temperature range Rated to operate from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Regulatory RoHS-compliant to support environmentally responsible manufacturing and procurement.

Typical Applications

• Telecommunications & Networking Use the device for protocol handling, packet processing and interfacing where large logic and plentiful I/O are required.
• High-performance Signal Processing Implement DSP functions and custom processing pipelines leveraging the device’s logic density and embedded memory.
• Industrial Control & Automation Deploy in industrial systems that require wide I/O, robust operation across −40 °C to 100 °C, and high integration to reduce board-level complexity.
• Complex System Integration Consolidate multiple functions or subsystems into a single FPGA design to reduce BOM and improve system-level determinism.

Unique Advantages

• High logic and memory density: 531,200 logic elements and approximately 28 Mbits of embedded RAM support large designs and on-chip data handling.
• Broad external interfacing: 744 I/O signals enable flexible connectivity for multiple peripherals, memory interfaces and board-level buses.
• Industrial-grade operation: Rated for −40 °C to 100 °C, providing thermal headroom for industrial deployments.
• Stratix IV family features: Family documentation highlights support for DSP blocks, clock networks, PLLs and high-speed transceiver capabilities useful for advanced designs.
• Surface-mount BGA packaging: 1152-ball BGA packages with a 42.5 × 42.5 mm footprint support high-pin-count, high-density board layouts.
• Regulatory compliance: RoHS compliance simplifies environmental qualification and supplier selection.

Why Choose EP4SE530H35I3G?

The EP4SE530H35I3G positions itself as a high-capacity, industrial-grade FPGA for engineers needing large programmable fabric, significant embedded memory, and extensive I/O in a single device. Its alignment with Stratix IV family capabilities makes it suitable for designs that demand DSP functionality, complex clocking and high-speed data handling as part of the architecture.

This device is well suited to teams building communications equipment, advanced signal processing systems, and industrial controllers who require long-term robustness, substantial on-chip resources, and a platform that supports integration of multiple functions to reduce system complexity.

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