EP4SE530H35I3N

IC FPGA 744 I/O 1152HBGA
Part Description

STRATIX® IV E Field Programmable Gate Array (FPGA) IC 744 28033024 531200 1152-BBGA, FCBGA

Quantity 1,400 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-HBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28033024

Overview of EP4SE530H35I3N – STRATIX® IV E FPGA, 531,200 logic elements, ~28 Mbits embedded memory, 744 I/O, 1152-BBGA

The EP4SE530H35I3N is a Stratix IV E Field Programmable Gate Array (FPGA) in a 1152-BBGA / FCBGA package. It is a high-density programmable logic device that combines a large number of logic elements, significant on-chip memory, and extensive I/O for demanding digital designs.

As a member of the Stratix IV E family, the device targets applications that require high logic capacity, substantial embedded memory, comprehensive I/O, and industrial temperature operation. Its architecture delivers integrated capabilities for signal processing, clocking, I/O interfacing, and system-level integration.

Key Features

  • Logic Capacity — 531,200 logic elements provide substantial programmable logic resources for complex designs and large-scale integration.
  • Embedded Memory — Approximately 28 Mbits of on-chip RAM (28,033,024 bits) for buffering, packet processing, and state storage without external memory in some functions.
  • I/O Density — 744 I/O pins to support wide parallel interfaces and high pin-count system connections.
  • Fabric Structure — Part of the Stratix IV E family; the device incorporates family-level architecture features including embedded memory structures, DSP blocks, clock networks, and PLLs as described in the device handbook.
  • High-Speed I/O and Protocol Support — The Stratix IV family documentation lists high-speed differential I/O features and support for a wide range of protocols and external memory interfaces.
  • Package and Mounting — Surface-mount 1152-BBGA, FCBGA package; supplier device package listed as 1152-HBGA (42.5×42.5).
  • Power — Device supply range specified at 870 mV to 930 mV.
  • Industrial Temperature Grade — Rated for operation from −40°C to 100°C, suitable for industrial-temperature deployments.
  • Compliance — RoHS compliant.

Typical Applications

  • High-bandwidth communications equipment — Large logic capacity and substantial embedded memory make the device suitable for protocol handling, packet processing, and interface bridging where many I/Os are required.
  • Digital signal processing systems — The Stratix IV family includes DSP blocks and clocking resources useful for processing-intensive applications that benefit from on-chip memory and programmable logic.
  • External memory interfaces and controllers — Extensive I/O and family-level support for external memory interfaces enable implementation of memory controllers and interface logic.
  • Industrial control and automation — Industrial temperature rating and robust I/O count support applications such as machine control, motor control front-ends, and factory automation systems.

Unique Advantages

  • High logic density: 531,200 logic elements allow consolidation of multiple functions into a single FPGA, reducing BOM and board complexity.
  • Significant on-chip memory: Approximately 28 Mbits of embedded RAM enables large buffers and local data storage without immediate reliance on external memory.
  • Extensive connectivity: 744 I/O pins accommodate wide parallel buses, multiple interfaces, and flexible pin assignments for system integration.
  • Designed for system integration: Family-level architecture features (DSP blocks, PLLs, clock networks, high-speed I/O) permit integration of timing, processing, and interface functions common to complex designs.
  • Industrial operating range: −40°C to 100°C operation supports deployment in temperature-challenging industrial environments.
  • Compact, surface-mount package: 1152-BBGA / FCBGA packaging offers a dense footprint for high-pin-count boards while supporting surface-mount assembly.

Why Choose EP4SE530H35I3N?

The EP4SE530H35I3N positions itself as a high-capacity Stratix IV E FPGA suitable for designs that demand large programmable logic resources, substantial on-chip memory, and a high number of I/Os within an industrial temperature envelope. Its family-level architecture provides the building blocks—embedded memory, DSP capabilities, clocking, and high-speed I/O—needed for complex signal processing and system integration tasks.

This device is well suited for engineering teams and procurement looking for a dense, industrial-grade FPGA option where integration, scalability, and robust I/O are key considerations. The combination of logic, memory, and package density supports long-term platform development and system consolidation.

Request a quote or submit a procurement inquiry to receive availability and pricing details for the EP4SE530H35I3N. Our team can provide lead-time information and support for volume requirements.

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