EP4SE530H35I4N

The EP4SE530H35I4N is a STRATIX® IV E series field programmable gate array (FPGA) from Intel provided in a 1152-ball FCBGA package. It delivers very high logic density, substantial on-chip RAM, and a large I/O count for industrial-grade embedded designs.

With 531,200 logic elements, approximately 28 Mbits of embedded memory, and 744 user I/Os, this device is intended for designs that require dense reprogrammable logic, significant local memory, and extensive connectivity within an industrial temperature range.

Key Features

• Core Logic  Provides 531,200 logic elements to implement large-scale, reconfigurable digital logic and custom processing blocks.
• Embedded Memory  Approximately 28 Mbits of on-chip RAM for buffering, caching, and local data storage to support complex data paths.
• I/O Capacity  744 user I/Os enable high-pin-count interfaces and dense external connectivity for parallel and multi-channel systems.
• Power  Operates from a core voltage range of 870 mV to 930 mV, allowing precise power-supply planning for high-density FPGA implementations.
• Package and Mounting  Supplied in a 1152-BBGA FCBGA package (supplier device package: 1152-HBGA, 42.5 × 42.5 mm) for surface-mount assembly in compact system boards.
• Temperature and Grade  Industrial-grade device specified for an operating temperature range of −40 °C to 100 °C, suited for demanding environmental conditions.
• Compliance  RoHS compliant, supporting environmental and regulatory requirements for lead-free assembly.

Typical Applications

• Industrial Control Systems  Industrial-grade temperature rating and high logic density make this FPGA suitable for control and automation platforms that require reconfigurable logic.
• Memory-Intensive Embedded Designs  Approximately 28 Mbits of on-chip RAM supports buffering and local data processing for complex embedded applications.
• High I/O Interface Systems  A 744-pin I/O complement enables designs that need extensive external device and sensor connectivity.
• High-Density Logic Implementations  531,200 logic elements support large-scale custom logic, protocol implementation, and parallel processing architectures.

Unique Advantages

• High Logic Integration: 531,200 logic elements reduce the need for multiple discrete devices by consolidating complex logic into a single FPGA.
• Substantial On-Chip Memory: Approximately 28 Mbits of embedded RAM simplifies board-level memory architectures and reduces external memory bandwidth needs.
• Large I/O Count: 744 user I/Os provide the physical connectivity required for multi-channel systems and dense peripheral interfacing.
• Industrial Temperature Range: Rated for −40 °C to 100 °C operation to support deployment in harsh or temperature-variable environments.
• Compact, Surface-Mount Package: 1152-BBGA (1152-HBGA supplier package, 42.5 × 42.5 mm) enables high-density board designs while supporting reliable surface-mount assembly.
• RoHS Compliant: Facilitates lead-free manufacturing and regulatory compliance for global production.

Why Choose EP4SE530H35I4N?

The EP4SE530H35I4N combines a very high count of logic elements, substantial embedded memory, and extensive I/O capacity in an industrial-grade FPGA package. These characteristics make it well suited for engineers developing complex, reconfigurable systems that require integration, local memory resources, and wide connectivity within challenging temperature environments.

For projects that demand scalable logic resources and long-term design robustness, this STRATIX® IV E device offers an integration-focused platform that aligns with industrial application requirements while supporting dense board-level implementation.

Request a quote or submit an inquiry to get pricing, availability, and assistance integrating EP4SE530H35I4N into your next design.