EP4SE530H40C2N

The EP4SE530H40C2N is a Stratix® IV E field programmable gate array from Intel offering high logic density and substantial on-chip memory in a compact FCBGA package. It combines 531,200 logic elements with approximately 28 Mbits of embedded memory and up to 976 I/O to support complex, memory‑intensive designs.

Designed for commercial-grade applications, this surface-mount FPGA operates from a core voltage range of 870 mV to 930 mV and across a 0 °C to 85 °C operating temperature range, making it suitable for a wide set of standard embedded and electronic systems.

Key Features

• Core Logic 531,200 logic elements provide high-density programmable logic for complex combinational and sequential designs.
• Embedded Memory Approximately 28 Mbits of on-chip RAM to support buffering, packet processing, and algorithm state storage.
• I/O Density Up to 976 I/O pins to enable extensive peripheral and system interfacing.
• Power Core voltage range of 870 mV to 930 mV for defined low-voltage operation.
• Package & Mounting 1517-BBGA FCBGA package (supplier package: 1517-HBGA, 42.5 × 42.5 mm) designed for surface-mount assembly.
• Operating Range & Grade Commercial-grade device with an operating temperature from 0 °C to 85 °C.
• Environmental Compliance RoHS-compliant construction for regulatory and manufacturing considerations.

Typical Applications

• High-density digital signal processing — Implement DSP algorithms and data-paths using the device’s large logic resource pool and embedded memory for buffering and processing.
• Network and packet processing — Leverage the high logic count and abundant I/O to build packet classification, forwarding, and custom protocol engines.
• Prototyping and system integration — Use the FPGA’s capacity to consolidate multiple functions during system prototype or integration phases where on-chip memory and I/O count matter.
• Complex control and interface bridging — Implement custom control logic, protocol translation, and interface aggregation using the extensive programmable resources and I/O.

Unique Advantages

• Highly integrated logic and memory: 531,200 logic elements combined with approximately 28 Mbits of embedded RAM reduce the need for external components and simplify board-level design.
• Extensive I/O capability: 976 I/O pins allow direct connection to numerous peripherals and high-pin-count interfaces without intermediate multiplexing.
• Compact FCBGA package: The 1517-HBGA (42.5 × 42.5 mm) footprint provides a high-density solution that is compatible with surface-mount assembly processes.
• Defined low-voltage core operation: 870 mV to 930 mV supply range supports predictable power planning and integration with low-voltage power rails.
• Commercial-grade temperature range: Rated 0 °C to 85 °C for standard embedded and electronics applications.
• RoHS compliance: Built to meet environmental restrictions to support compliant manufacturing.

Why Choose EP4SE530H40C2N?

The EP4SE530H40C2N delivers a balanced combination of logic capacity, on-chip memory, and I/O density suited for complex, memory‑intensive FPGA designs. As a Stratix® IV E device from Intel, it targets engineers and teams needing substantial programmable resources in a surface-mount FCBGA package for commercial applications.

Its specification set—large logic element count, approximately 28 Mbits of embedded RAM, nearly 1,000 I/O, defined low-voltage operation, and RoHS compliance—offers a scalable and robust platform for system architects focused on integration density and predictable electrical and thermal behavior.

Request a quote for EP4SE530H40C2N to get pricing and availability information or to submit a purchase inquiry for this Stratix® IV E FPGA.