EP4SE530H40C3

The EP4SE530H40C3 is an Intel STRATIX IV E field programmable gate array delivering very high logic capacity and substantial embedded memory for complex digital designs. This commercial-grade, surface-mount FCBGA device is intended for systems that require large-scale logic integration, extensive I/O connectivity, and significant on-chip RAM.

Key hardware attributes include 531,200 logic elements, approximately 28 Mbits of embedded RAM, and 976 general-purpose I/Os, all packaged in a 1517-ball FCBGA (1517-HBGA, 42.5 × 42.5 mm) with a core voltage supply range of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic — 531,200 logic elements provide high-density programmable logic resources for complex implementations and large-scale designs.
• Embedded Memory — Total on-chip RAM of 28,033,024 bits (approximately 28 Mbits) to support memory-intensive functions without immediate reliance on external memory.
• I/O Connectivity — 976 I/O pins support wide parallel interfaces and dense peripheral integration for multi-channel systems.
• Power — Specified voltage supply range of 870 mV to 930 mV for the device core.
• Package & Mounting — Supplied in a 1517-BBGA FCBGA package (supplier package: 1517-HBGA, 42.5 × 42.5 mm) for surface-mount PCB assembly.
• Operating Conditions — Commercial grade with an operating temperature range from 0 °C to 85 °C.
• Regulatory — RoHS compliant.

Typical Applications

• High-density digital systems — Use where hundreds of thousands of logic elements are required to implement complex state machines, data-path logic, or custom accelerators.
• Memory-centric designs — Leverage approximately 28 Mbits of on-chip RAM for buffering, FIFOs, and temporary data storage to reduce external memory dependencies.
• I/O-intensive platforms — Ideal for systems that need extensive parallel and multi-channel interfacing, benefitting from the 976 available I/O pins.
• Compact, high-density PCB layouts — The 1517-BBGA FCBGA package enables dense board-level integration in surface-mount assemblies.

Unique Advantages

• High logic capacity: 531,200 logic elements enable consolidation of multiple functions into a single device, reducing component count and board complexity.
• Substantial on-chip RAM: Approximately 28 Mbits of embedded memory supports data buffering and local storage, minimizing frequent external memory access.
• Extensive I/O: 976 I/Os simplify routing for multi-interface designs and support high channel counts without external expanders.
• Compact FCBGA package: The 1517-HBGA (42.5 × 42.5 mm) footprint provides a high-pin-count solution in a single surface-mount package for space-constrained boards.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C aligns with a wide range of commercial applications.
• RoHS compliance: Meets regulatory requirements for lead-free manufacturing processes.

Why Choose EP4SE530H40C3?

The EP4SE530H40C3 positions itself as a high-capacity, on-chip memory-rich FPGA for commercial applications that demand large programmable logic resources, significant embedded RAM, and extensive I/O connectivity. Its FCBGA package and surface-mount form factor support high-density board designs where consolidating functionality into a single device is a priority.

This device is well-suited for development teams and OEMs implementing complex digital systems that benefit from substantial logic element counts and embedded memory while operating within standard commercial temperature and voltage ranges. As part of the STRATIX IV E family, it provides a predictable hardware platform for scaling and integration into advanced designs.

Request a quote or submit a purchase inquiry to evaluate EP4SE530H40C3 for your next high-density FPGA design.