EP4SE530H40C2ES

The EP4SE530H40C2ES is a high-density STRATIX® IV E field programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA package. It delivers 531,200 logic elements, approximately 28 Mbits of embedded memory, and 976 general-purpose I/Os to support complex, resource-intensive designs.

With a core voltage supply range of 870 mV to 930 mV and a commercial operating temperature range of 0 °C to 85 °C, this surface-mount device is targeted at applications that require substantial logic capacity, abundant on-chip memory, and a large I/O footprint in a compact BGA form factor.

Key Features

• Core Logic  531,200 logic elements provide a large programmable fabric for implementing complex digital logic and custom hardware functions.
• Embedded Memory  Approximately 28 Mbits of on-chip RAM for buffering, caching, and intermediate data storage within user designs.
• I/O Capacity  976 I/O pins enable extensive external connectivity for multi-channel interfaces, parallel buses, and high-pin-count systems.
• Power Supply  Core voltage range of 870 mV to 930 mV supports the device’s operating requirements and power domain planning.
• Package & Mounting  1517-BBGA (FCBGA) package; supplier device package specified as 1517-HBGA (42.5 × 42.5 mm). Surface-mount mounting for PCB assembly.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial applications.
• Regulatory  RoHS compliant.

Typical Applications

• Telecommunications & Networking  Use the device’s large logic capacity and high I/O count to implement packet processing, switching logic, and protocol bridging.
• Data Processing & Acceleration  Deploy the FPGA for hardware acceleration tasks and data-path functions that benefit from substantial on-chip memory and dense logic resources.
• Video & Imaging  Leverage parallel logic and embedded RAM for image buffering, pipeline processing, and real-time video functions.
• System Prototyping & Integration  The combination of logic capacity, I/O density, and a compact BGA package supports complex system prototypes and board-level integration.

Unique Advantages

• High logic density: 531,200 logic elements enable integration of large, complex designs on a single device, reducing the need for multiple FPGAs.
• Substantial on-chip memory: Approximately 28 Mbits of embedded RAM supports buffering and local data storage to improve system responsiveness.
• Extensive external connectivity: 976 I/Os give designers flexibility to connect numerous peripherals and interfaces without external multiplexing.
• Compact BGA footprint: 1517-BBGA / 1517-HBGA (42.5 × 42.5 mm) packaging delivers high integration in a board-friendly surface-mount form.
• Commercial temperature grading: Rated 0 °C to 85 °C for standard commercial deployments and development environments.
• RoHS compliant: Conforms to RoHS requirements for lead-free designs and environmental compliance.

Why Choose EP4SE530H40C2ES?

The EP4SE530H40C2ES combines a very large logic fabric with significant embedded memory and nearly 1,000 I/Os in a compact BGA package, making it suitable for designs that require high integration and extensive external connectivity. Its electrical and thermal specifications provide a clear platform for commercial-grade applications where on-chip resources and I/O density are primary considerations.

This device is well matched to engineering teams and procurement professionals working on high-capacity FPGA implementations, prototyping advanced systems, or consolidating multiple functions into a single programmable device. The combination of resources, package density, and RoHS compliance supports scalable designs and standard commercial deployment models.

Request a quote or submit a pricing inquiry to check availability and lead times for EP4SE530H40C2ES.