EP4SE530H40C3ES

The EP4SE530H40C3ES is a high-density STRATIX® IV E field programmable gate array (FPGA) from Intel supplied in a 1517-BBGA FCBGA package. It provides a large logic fabric and extensive I/O in a surface-mount package for commercial-grade applications.

With 531,200 logic elements, approximately 28 Mbits of embedded memory, and 976 user I/Os, this device addresses designs that require significant on-chip resources and high interfacing capacity while operating from a low-voltage supply (870 mV to 930 mV) across a commercial temperature range (0 °C to 85 °C).

Key Features

• Logic Capacity  531,200 logic elements deliver substantial programmable logic resources for large-scale designs and complex custom logic implementations.
• Embedded Memory  Approximately 28 Mbits of on-chip RAM provide abundant embedded memory for buffering, look-up tables, and data paths.
• I/O Resources  976 user I/Os enable extensive external interfacing for multi-channel data acquisition, parallel buses, and dense connector implementations.
• Package & Mounting  1517-BBGA (FCBGA) package with supplier device package 1517-HBGA (42.5 × 42.5 mm) in a surface-mount form factor suitable for compact board-level integration.
• Power  Operates from a core supply range of 870 mV to 930 mV, supporting low-voltage system architectures.
• Temperature & Grade  Commercial grade device specified for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density signal processing  Large logic and embedded memory make the device suitable for parallel DSP tasks, custom pipelines, and hardware-accelerated algorithms.
• Networking and communications  Extensive I/O count supports multi-lane interfaces, protocol bridging, and high-channel-count connectivity.
• Prototyping and system validation  High logic capacity and ample on-chip RAM enable complex prototypes and hardware emulation of system functions.
• Data acquisition and instrumentation  Large I/O and embedded memory facilitate multi-channel sampling, buffering, and pre-processing at the board level.

Unique Advantages

• High logic density: 531,200 logic elements reduce the need for multiple devices and simplify partitioning of large designs.
• Significant on-chip memory: Approximately 28 Mbits of embedded RAM minimize external memory dependencies and improve data-path performance.
• Extensive I/O capability: 976 user I/Os enable dense external connectivity and flexible interfacing with peripherals and high-speed links.
• Compact FCBGA footprint: 1517-BBGA (1517-HBGA, 42.5 × 42.5 mm) package delivers a high pin count in a board-friendly surface-mount form factor.
• Low-voltage core operation: 870 mV to 930 mV supply range supports integration into low-power system architectures.
• Commercial-grade availability: Specified for 0 °C to 85 °C operation and RoHS compliant for mainstream electronic applications.

Why Choose EP4SE530H40C3ES?

The EP4SE530H40C3ES combines substantial programmable logic, plentiful embedded memory, and a very high I/O count in a single STRATIX® IV E FPGA package, making it suitable for designers who need on-chip capacity and extensive external connectivity. Its low-voltage core range and commercial temperature rating match common board- and system-level requirements.

As an Intel STRATIX® IV E device, it offers a scalable platform for large designs, enabling consolidation of functions into fewer devices and simplifying system architecture. This part is well suited to development teams and procurement looking for a high-resource FPGA with a compact FCBGA footprint and RoHS compliance.

Request a quote or submit a purchase inquiry for EP4SE530H40C3ES to receive pricing and availability information tailored to your project requirements.