EP4SE530H40C3NES

The EP4SE530H40C3NES is a Stratix IV E family FPGA offering a high-density programmable fabric for commercial embedded and high-performance applications. It integrates a large logic capacity and substantial on-chip memory along with extensive I/O to support complex system integration.

Designed for applications that require significant logic resources, on-chip RAM, and dense I/O, this device provides a balance of compute fabric, memory, and interfacing in a 1517-ball FCBGA package for surface-mount board designs.

Key Features

• Core / Fabric — 531,200 logic elements provide extensive programmable logic resources for complex designs and partitioning.
• Embedded Memory — Approximately 28 Mbits of on-chip RAM to support buffering, large state machines, and data-path storage without immediate external memory dependence.
• I/O Density & Interface Support — 976 user I/O pins enable dense external connectivity; the Stratix IV family documentation lists high-speed differential I/O features including DPA and Soft-CDR.
• Power Supply — Core voltage range specified at 870 mV to 930 mV for device operation.
• Package & Mounting — 1517‑BBGA (FCBGA) supplier package 1517‑HBGA with 42.5 × 42.5 mm footprint; surface-mount device suitable for compact board layouts.
• Operating Range & Grade — Commercial grade device with operating temperature 0 °C to 85 °C.
• Standards Compliance — RoHS compliant.
• Family Documentation — Stratix IV device handbook and related documentation describe architecture features such as embedded memory, DSP blocks, PLLs, clock networks, and external memory interfaces to guide system design.

Typical Applications

• High-density signal processing — Use the large logic element count and substantial embedded RAM for FPGA-based DSP pipelines, multi-channel filtering, and parallel compute tasks.
• Communications & Networking — Dense I/O and documented high-speed differential I/O features support complex protocol bridging, packet processing, and interface aggregation in commercial networking equipment.
• Board-level system integration — The FCBGA package and surface-mount format enable compact, high-density board designs where many I/O and embedded resources are required.

Unique Advantages

• Large logic capacity: 531,200 logic elements reduce the need for multi-device partitioning in feature-rich designs.
• Significant on-chip RAM: Approximately 28 Mbits of embedded memory supports buffering and local storage to simplify external memory requirements.
• High I/O count: 976 I/O pins provide flexibility for dense peripheral and bus connectivity on complex boards.
• Documented architecture features: Stratix IV family documentation covers embedded memory, DSP resources, PLLs, and I/O capabilities to help accelerate implementation and validation.
• Compact package footprint: 1517-ball FCBGA (42.5 × 42.5 mm supplier package) enables integration into space-constrained commercial products.
• Regulatory and manufacturing readiness: RoHS compliance and surface-mount packaging align with standard commercial manufacturing flows.

Why Choose EP4SE530H40C3NES?

The EP4SE530H40C3NES positions itself as a high-density Stratix IV E FPGA option for commercial designs that need substantial programmable logic, embedded memory and dense I/O in a single device. Its combination of 531,200 logic elements, approximately 28 Mbits of on-chip RAM, and 976 I/O pins supports complex signal-processing, protocol handling, and system-integration tasks without immediate reliance on additional devices.

Backed by Stratix IV family documentation and engineering resources, this part is suited for teams developing commercial embedded systems and networking or compute-heavy applications that require verified device architecture details and a compact FCBGA package for board-level integration.

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