EP4SE530H40C4N

The EP4SE530H40C4N is a STRATIX® IV E field programmable gate array (FPGA) from Intel, supplied in a 1517-BBGA FCBGA package. It combines a high logic element count with substantial on-chip memory and a large number of user I/Os to address demanding integration and high-density logic requirements.

This commercial-grade, surface-mount device targets designs that require deep embedded memory, large logic capacity, and high I/O density while operating within a low-core voltage range of 870 mV to 930 mV and an ambient temperature range of 0 °C to 85 °C.

Key Features

• Core and Logic 531,200 logic elements provide significant capacity for complex digital designs and custom hardware accelerators.
• Embedded Memory Approximately 28 Mbits of on‑chip RAM (28,033,024 bits) supports large data buffers, FIFOs, and state storage without external memory.
• High I/O Count 976 user I/O pins enable wide parallel buses, multiple interface lanes, and extensive peripheral connectivity.
• Power Operates with a core supply in the range of 870 mV to 930 mV, suitable for designs targeting low-voltage core domains.
• Package & Mounting Delivered in a 1517-BBGA (FCBGA) package, supplier device package 1517-HBGA (42.5 × 42.5 mm), designed for surface-mount assembly.
• Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C for general-purpose applications.
• Compliance RoHS compliant to support environmentally conscious designs and regulatory requirements.

Typical Applications

• High-density logic and custom acceleration — Implement complex state machines, data processing pipelines, and hardware acceleration using the device’s 531,200 logic elements.
• Large on-chip buffering and streaming — Approximately 28 Mbits of embedded RAM enable on-chip buffering for packet processing, video frame storage, or data streaming tasks.
• Multi-interface and high-I/O systems — With 976 I/Os, the FPGA supports systems requiring many parallel interfaces, sensor arrays, or multi-lane connectivity.

Unique Advantages

• Substantial logic capacity: 531,200 logic elements let you consolidate complex functions into a single device, reducing system BOM and board space.
• Significant embedded memory: Approximately 28 Mbits of on-chip RAM lowers dependence on external memory and simplifies timing and routing for high-throughput designs.
• Exceptional I/O density: 976 user I/Os provide flexibility for parallel interfaces and extensive peripheral integration without multiplexing compromises.
• Low-voltage core operation: Core supply range of 870 mV to 930 mV supports low-power core domains and designs optimized for reduced power consumption.
• Surface-mount, high-pin-count package: The 1517-BBGA FCBGA package (1517-HBGA, 42.5 × 42.5 mm) enables compact board layouts for high-density systems.
• RoHS compliant: Facilitates regulatory alignment for commercial products and environmentally conscious manufacturing.

Why Choose EP4SE530H40C4N?

The EP4SE530H40C4N positions itself as a high-capacity, commercially graded FPGA that combines large logic resources, significant embedded memory, and very high I/O count in a single surface-mount FCBGA package. Its low core voltage range and RoHS compliance make it suitable for modern commercial designs that balance performance and power considerations.

This device is ideal for engineering teams building complex, high-density digital systems that benefit from consolidated hardware logic, substantial on-chip RAM, and abundant I/O—providing scalability and integration that can simplify board design and reduce component count.

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