EP4SE530H40I3G

The EP4SE530H40I3G is an Intel (Altera) Stratix IV family FPGA offering a high-density programmable logic fabric for demanding embedded and industrial applications. It combines a large logic element count, substantial on-chip memory, and a wide complement of I/O to address high-bandwidth processing, protocol bridging, and system integration tasks.

Designed for industrial use, the device delivers approximately 531,200 logic elements, roughly 28 Mbits of embedded memory, and 976 I/O pins in a 1517-ball FCBGA package. The device supports an operating temperature range from −40 °C to 100 °C and a core supply voltage range of 870 mV to 930 mV, making it suitable for robust, temperature-demanding environments.

Key Features

• Core Density  Approximately 531,200 logic elements provide ample programmable fabric for complex custom logic, protocol implementation, and system glue logic.
• Embedded Memory  Approximately 28 Mbits of on-chip RAM for buffering, packet processing, and intermediate storage without immediate external memory dependency.
• I/O and Interfaces  976 device I/Os enable wide external connectivity for parallel interfaces, high-pin-count peripherals, and multi-channel designs.
• Architecture Highlights  Documentation for the Stratix IV family describes features such as high-speed transceivers, DSP resources, PLLs, and flexible clock networks for high-bandwidth and precision-timed applications.
• Package and Mounting  Supplied in a 1517-ball FCBGA (supplier package: 1517-HBGA, 45×45 mm) surface-mount package for compact board-level integration.
• Power  Core supply range of 870 mV to 930 mV, enabling operation within modern low-voltage FPGA power domains.
• Industrial Temperature Grade  Rated for −40 °C to 100 °C operation to meet industrial temperature requirements.
• Regulatory Compliance  RoHS-compliant manufacturing.

Typical Applications

• High‑Performance Networking & Telecom  Use the device’s high logic density, embedded memory, and Stratix IV family transceiver/clocking features for packet processing, protocol bridging, and line-rate functions.
• Digital Signal Processing & Instrumentation  Leverage the on-chip memory and DSP-oriented architecture details to implement real-time filtering, data aggregation, and acquisition front-ends.
• Industrial Control & Automation  Industrial-grade temperature support and abundant I/O make the device suitable for motion control, machine vision pre-processing, and factory automation I/O aggregation.
• Embedded Compute & System Integration  High logic element count and large I/O complement enable complex control logic, protocol handling, and custom accelerators within compact systems.

Unique Advantages

• High Logic Density:  Approximately 531,200 logic elements let designers implement large, integrated systems on a single device, reducing board-level complexity.
• Significant On‑Chip Memory:  About 28 Mbits of embedded RAM supports deep buffering and low-latency data paths without immediate external memory.
• Extensive I/O Count:  976 I/Os provide flexibility for parallel interfaces, multiple memory buses, or extensive sensor and peripheral connectivity.
• Industrial Temperature Capability:  Rated operation from −40 °C to 100 °C addresses temperature-challenging deployments in industrial environments.
• Compact FCBGA Packaging:  1517-ball FCBGA (45×45 mm) surface-mount package balances I/O density with board-area efficiency for compact designs.
• RoHS Compliance:  Manufactured to RoHS standards for regulatory and environmental conformity.

Why Choose EP4SE530H40I3G?

The EP4SE530H40I3G is positioned for engineers who need a high-density, industrial-grade FPGA platform with substantial embedded memory and a broad I/O footprint. Its alignment with the Stratix IV device family provides architectural features—such as high-speed transceiver capability, DSP resources, and flexible clocking—that support demanding data-path, protocol, and signal-processing designs.

Choose this device when you require a single-chip solution to consolidate logic, buffering, and I/O on a compact FCBGA package while operating across a wide industrial temperature range. The combination of logic capacity, memory, and I/O makes it suitable for complex embedded systems, communications equipment, and industrial automation projects where long-term robustness and integration density matter.

Request a quote or submit an inquiry to obtain pricing and availability information for EP4SE530H40I3G and to discuss application-specific requirements with our team.