EP4SE530H40I3

IC FPGA 976 I/O 1517HBGA
Part Description

STRATIX® IV E Field Programmable Gate Array (FPGA) IC 976 28033024 531200 1517-BBGA, FCBGA

Quantity 1,984 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-HBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O976Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28033024

Overview of EP4SE530H40I3 – STRATIX® IV E FPGA, 531,200 Logic Elements, 976 I/Os

The EP4SE530H40I3 is a STRATIX® IV E field programmable gate array (FPGA) from Intel designed for large-scale, programmable logic implementations. With 531,200 logic elements and approximately 28 Mbits of embedded memory, it targets applications that require substantial on-chip logic and memory resources along with a high I/O count.

Supplied in a 1517-BBGA/FCBGA package (supplier package 1517-HBGA, 42.5 × 42.5 mm) and rated for industrial operation, the device is suited to board-level integration where surface-mount mounting, wide operating temperature, and low-voltage core supply are required.

Key Features

  • Logic Capacity — 531,200 logic elements provide large programmable logic resources for complex designs and high-density implementations.
  • Embedded Memory — Approximately 28 Mbits of on-chip RAM to support buffering, frame storage, and intermediate data processing without external memory dependencies.
  • I/O Density — 976 I/O pins to support wide parallel interfaces, multi-channel connectivity, and extensive board-level signaling.
  • Package — 1517-BBGA, FCBGA package (supplier device package 1517-HBGA, 42.5 × 42.5 mm) optimized for high-pin-count board layouts and reliable soldered mounting.
  • Power and Core Voltage — Core supply range of 870 mV to 930 mV suitable for low-voltage FPGA core operation.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, supporting deployments in demanding ambient environments.
  • Mounting and Compliance — Surface-mount device with RoHS compliance for environmentally conscious manufacturing.

Typical Applications

  • Networking & Communications: High I/O count and large logic capacity enable multi-channel interface aggregation and protocol processing on a single device.
  • Data Processing & Acceleration: Ample logic elements and embedded memory support hardware-accelerated packet processing, signal processing, and custom compute pipelines.
  • Industrial Control & Automation: Industrial temperature rating and extensive I/Os make the device suitable for machine control, motion control, and sensor interfacing in factory environments.
  • Test & Measurement: Large on-chip resources support complex timing, data capture, and real-time analysis functions required in instrumentation.

Unique Advantages

  • Large, Single-Device Integration: Combines 531,200 logic elements and substantial embedded memory to reduce the need for multiple discrete devices and simplify board design.
  • High I/O Capacity: 976 I/Os support extensive peripheral connectivity and parallel interfaces, minimizing external multiplexing or passthrough logic.
  • Industrial Reliability: −40 °C to 100 °C operating temperature rating enables deployment in harsher environmental conditions common in industrial systems.
  • Compact High-Pin Package: 1517-BBGA/FCBGA (1517-HBGA supplier package) provides a high-pin-count solution in a manageable footprint for complex PCBs.
  • Low-Voltage Core Compatibility: 870–930 mV supply range aligns with low-voltage power domains used in modern FPGA-based systems.
  • Regulatory Compliance: RoHS compliance supports environmentally responsible manufacturing and procurement requirements.

Why Choose EP4SE530H40I3?

The EP4SE530H40I3 positions itself as a high-capacity, industrial-grade FPGA option for designs that require extensive programmable logic, significant embedded memory, and a large number of I/Os. Its package and electrical characteristics make it appropriate for board-level integration where compact, high-pin-count FPGAs are needed.

Manufactured by Intel, this STRATIX® IV E device is suited for engineering teams building complex communications, data-processing, and industrial control systems that demand scalable logic resources and reliable operation across a wide temperature range.

Request a quote or submit an inquiry today to discuss availability, pricing, and integration support for the EP4SE530H40I3.

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