EP4SE530H40I4

IC FPGA 976 I/O 1517HBGA
Part Description

STRATIX® IV E Field Programmable Gate Array (FPGA) IC 976 28033024 531200 1517-BBGA, FCBGA

Quantity 1,867 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-HBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O976Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28033024

Overview of EP4SE530H40I4 – STRATIX® IV E Field Programmable Gate Array (FPGA) IC 976 28033024 531200 1517-BBGA, FCBGA

The EP4SE530H40I4 is a STRATIX® IV E field programmable gate array (FPGA) manufactured by Intel, delivering very high logic capacity and on-chip memory for complex digital designs. With 531,200 logic elements, approximately 28 Mbits of embedded memory, and 976 I/Os, it targets applications that demand dense logic integration, large embedded RAM, and extensive I/O connectivity.

Designed for surface-mount deployment in a 1517-BBGA (1517-HBGA, 42.5 × 42.5 mm) package and rated for industrial use, this device supports operation across a broad temperature range and low-voltage core supplies to suit demanding embedded and industrial systems.

Key Features

  • Core Capacity  Provides 531,200 logic elements to implement large-scale custom logic, state machines, and parallel datapaths.
  • Embedded Memory  Approximately 28 Mbits of on-chip RAM for buffering, lookup tables, and on-die data storage without external memory.
  • High I/O Count  976 user I/Os support complex interfacing and high channel count designs.
  • Package & Mounting  1517-BBGA (FCBGA) package with supplier device package 1517-HBGA (42.5 × 42.5 mm) for surface-mount assembly and compact board integration.
  • Power Supply  Core voltage operation in the 870 mV to 930 mV range to match system power-rail requirements.
  • Industrial Temperature Range  Rated for −40 °C to 100 °C operation and specified as industrial grade for reliable use in temperature-challenging environments.
  • RoHS Compliant  Manufactured to meet RoHS environmental compliance requirements.

Typical Applications

  • High-density digital processing  Implements large custom datapaths and parallel processing logic using the device's extensive logic element count and embedded memory.
  • High I/O systems  Supports systems that require many external interfaces or channel connections, leveraging 976 user I/Os for dense signal routing.
  • Industrial control and automation  Industrial-grade rating and −40 °C to 100 °C operating range make it suitable for control systems and factory automation equipment.
  • Prototype and custom logic platforms  Provides a high-capacity FPGA option for prototyping complex SoC functions or consolidating multiple discrete components into programmable logic.

Unique Advantages

  • Very large logic capacity: 531,200 logic elements enable implementation of complex, highly parallel designs without external partitioning.
  • Substantial embedded memory: Approximately 28 Mbits of on-chip RAM reduces reliance on external memory for buffering and lookup operations.
  • Extensive I/O resources: 976 I/Os allow flexible interfacing and support for multi-channel or high-pin-count subsystems.
  • Industrial-rated operation: Specification for −40 °C to 100 °C and industrial grade suitability supports deployment in demanding environments.
  • Compact BGA package: 1517-BBGA (1517-HBGA, 42.5 × 42.5 mm) provides a dense, surface-mount footprint for board-level integration.

Why Choose EP4SE530H40I4?

The EP4SE530H40I4 positions itself as a high-capacity, industrial-grade FPGA option within the STRATIX® IV E family from Intel, combining a very large logic element count with substantial on-chip RAM and a high I/O count. These characteristics make it well suited to designers consolidating complex logic, implementing large datapaths, or building high-channel-count systems.

For engineering teams and procurement sourcing robust, high-density programmable logic, this device offers a balance of integration, thermal tolerance, and packaging suitable for demanding embedded and industrial applications.

Request a quote or submit a quote to receive pricing and availability information for the EP4SE530H40I4.

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