EP4SE530H40I3N

The EP4SE530H40I3N is an Intel STRATIX® IV E field programmable gate array (FPGA) offered in a 1517‑BBGA FCBGA package. It delivers a high logic density fabric combined with substantial embedded RAM and a large I/O count for industrial-grade applications.

With 531,200 logic elements, approximately 28 Mbits of embedded memory and 976 user I/O, this device is targeted at designs that require high integration, flexible I/O connectivity and operation across an extended temperature range.

Key Features

• Core Logic: 531,200 logic elements provide significant programmable capacity for complex digital designs and system integration.
• Embedded Memory: Approximately 28 Mbits of on-chip RAM to implement large buffers, packet queues or localized data storage without external memory.
• I/O Resources: 976 user I/O pins support high‑pin‑count connectivity for dense system interfaces and parallel buses.
• Family Features (Stratix IV E): Device handbook details architecture features including high‑speed transceivers, embedded memory structures, DSP blocks and PLLs for clock management.
• Package & Mounting: 1517‑BBGA (FCBGA) package, supplier device package 1517‑HBGA (42.5 × 42.5 mm) with surface‑mount mounting type for board‑level integration.
• Power: Core voltage supply range of 870 mV to 930 mV for the device core.
• Temperature Range & Grade: Industrial grade with operating temperature from −40 °C to 100 °C for deployment in extended‑temperature environments.
• Compliance: RoHS compliant.

Typical Applications

• High‑density digital processing: Implement complex custom logic, protocol handling and packet processing where large logic capacity and embedded RAM are required.
• Communications and networking equipment: Use the substantial I/O and Stratix IV E family transceiver and I/O features to support multi‑lane interfaces and protocol bridging.
• Industrial control and automation: Deploy in systems requiring robust operation across −40 °C to 100 °C and flexible I/O for sensor, actuator and control interfaces.
• Test, measurement and instrumentation: Integrate large amounts of custom signal processing and buffering in a single FPGA package to reduce board complexity.

Unique Advantages

• High programmable capacity: 531,200 logic elements enable consolidation of multiple functions into one FPGA, reducing system BOM and board real estate.
• Significant on‑chip memory: Approximately 28 Mbits of embedded RAM reduce dependence on external memory for intermediate buffering and dataflow tasks.
• Extensive I/O: 976 I/O pins provide flexible connectivity for high‑pin‑count interfaces and parallel data paths.
• Industrial readiness: Rated for −40 °C to 100 °C operation and classified as industrial grade for deployment in harsh or temperature‑varying environments.
• Compact, board‑level package: 1517‑BBGA FCBGA (42.5 × 42.5 mm supplier package) supports high‑density mounting with a surface‑mount footprint.
• Standards‑based family documentation: Stratix IV device handbook coverage provides architecture, I/O and transceiver guidance to support system design.

Why Choose EP4SE530H40I3N?

The EP4SE530H40I3N combines very high logic capacity, substantial embedded memory and a large number of I/O in an industrial‑grade STRATIX® IV E FPGA. Its package and electrical characteristics make it suitable for designs that require consolidation of complex digital functions, extensive interfacing and reliable operation across an extended temperature range.

This device is well suited to engineering teams building high‑integration systems in communications, industrial automation, test equipment and other applications where programmable capacity, on‑chip memory and I/O density are primary selection criteria. Documentation for the Stratix IV family is available to guide implementation of the device’s architecture, I/O and transceiver capabilities.

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