EP4SE530H40C4

The EP4SE530H40C4 is an Intel STRATIX® IV E field-programmable gate array (FPGA) offered in a 1517-BBGA (FCBGA) package. It provides high logic capacity, substantial embedded memory, and a large I/O count for complex programmable-logic implementations in commercial-grade designs.

Targeted at applications that require large-scale logic resources and abundant I/O, this device delivers a combination of logic density, on-chip RAM, and compact surface-mount packaging with defined operating voltage and temperature ranges.

Key Features

• Core Logic Capacity — 531,200 logic elements to support large, complex designs and high-density programmable logic.
• Embedded Memory — Approximately 28 Mbits of on-chip RAM (28,033,024 bits) for buffering, lookup tables, and data storage close to logic.
• I/O Resources — 976 user I/O pins to support extensive external interfacing and parallel connectivity requirements.
• Power Supply — Operates from a core voltage range of 870 mV to 930 mV, enabling defined power planning for system integration.
• Package and Mounting — 1517-BBGA (FCBGA) package, supplier package 1517-HBGA with 42.5 × 42.5 mm footprint; surface-mount mounting for board-level assembly.
• Operating Conditions — Commercial-grade device specified for 0 °C to 85 °C ambient operation.
• Regulatory — RoHS compliant for adherence to common environmental requirements.

Typical Applications

• High-density logic designs — Implements large-scale programmable logic functions where 531,200 logic elements meet complex timing and combinational requirements.
• Memory-intensive functions — Uses approximately 28 Mbits of embedded RAM for packet buffering, FIFOs, and on-chip data structures.
• Multi-interface systems — Leverages 976 I/O pins for aggregating multiple parallel and serial interfaces on a single FPGA.
• Compact board-level implementations — Surface-mount 1517-BBGA packaging fits high-density PCB layouts while providing substantial logic and I/O in a single component.

Unique Advantages

• Extensive logic resources: 531,200 logic elements enable consolidation of complex functions into a single device, reducing board-level component count.
• Significant on-chip RAM: Approximately 28 Mbits of embedded memory supports local buffering and high-throughput data handling without external memory.
• Large I/O capacity: 976 I/O pins allow flexible connectivity options for multi-device systems and dense peripheral integration.
• Defined power envelope: Core voltage range of 870 mV to 930 mV provides clear parameters for power delivery design and regulation selection.
• Commercial-grade specification: Rated for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.
• Surface-mount FCBGA package: 1517-BBGA (42.5 × 42.5 mm supplier package) supports compact assemblies while providing high pin count density.

Why Choose EP4SE530H40C4?

The EP4SE530H40C4 positions itself as a high-capacity STRATIX® IV E FPGA option for commercial applications that require substantial logic density, embedded memory, and extensive I/O in a surface-mount FCBGA footprint. Its combination of 531,200 logic elements, approximately 28 Mbits of on-chip RAM, and 976 I/O pins makes it appropriate for consolidating multiple functions and reducing system complexity.

For design teams focused on scalable programmable logic, the EP4SE530H40C4 provides clearly specified electrical and thermal operating ranges and RoHS compliance, supporting repeatable integration into commercial product lines where those attributes are required.

Request a quote or submit a sales inquiry to evaluate EP4SE530H40C4 for your next high-density FPGA design.