EP4SE530H40C3G

The EP4SE530H40C3G is an Intel FPGA offered as part of the Stratix IV device family, providing a high-density programmable fabric for complex digital designs. It delivers 531,200 logic elements and approximately 28 Mbits of embedded memory, making it suitable for designs that require large logic capacity and on-chip storage.

With 976 I/O pins, a surface-mount 1517-BBGA / 1517-HBGA (45×45) package, and a commercial operating range of 0 °C to 85 °C, this device targets high-density digital systems in networking, signal processing, and other performance-focused applications where integration and scalability matter.

Key Features

• Core Capacity — 531,200 logic elements provide extensive programmable logic for complex system integration and parallel processing.
• Embedded Memory — Approximately 28 Mbits of on-chip RAM (28,033,024 bits) to support buffers, FIFOs, and data-intensive logic without external memory for some functions.
• I/O Density — 976 user I/O pins to interface with high-channel-count peripherals, interfaces, and board-level interconnects.
• Power and Supply — Core voltage supply specified from 870 mV to 930 mV to match system power architectures and regulator designs.
• Package and Mounting — 1517-BBGA / FCBGA package (supplier package: 1517-HBGA, 45×45) designed for surface-mount assembly on compact PCBs.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for regulatory and environmental alignment.
• Stratix IV Family Capabilities — The Stratix IV device handbook lists architecture-level features such as embedded memory, digital signal processing (DSP) blocks, clock networks, PLLs, and high-speed transceiver support relevant to Stratix IV devices.

Typical Applications

• High-density Networking & Telecom — Use the device’s large logic capacity and high I/O count for packet processing, switching logic, and interface aggregation.
• Signal Processing & DSP Systems — Leverage the substantial logic fabric and embedded memory for algorithm acceleration, filtering, and real-time data paths.
• Video and Imaging — Implement multi-channel video processing pipelines and buffering with the device’s memory and I/O resources.
• Prototyping and Complex SoC Integration — Integrate large, custom hardware functions and peripheral interfaces for system validation and development.

Unique Advantages

• High Logic Density: 531,200 logic elements enable integration of large custom digital subsystems on a single device, reducing board-level complexity.
• Significant On-Chip Memory: Approximately 28 Mbits of embedded RAM supports data buffering and local storage to reduce dependence on external memory for many functions.
• Extensive I/O: 976 I/O pins provide the connectivity required for multi-channel systems, high-speed interfaces, and dense peripheral integration.
• Commercial Temperature Rating: 0 °C to 85 °C operation supports standard commercial applications and system designs.
• Compact, Surface-Mount Package: 1517-BBGA / 1517-HBGA (45×45) packaging balances a high pin count with manufacturable surface-mount assembly.
• RoHS Compliant: Meets environmental compliance requirements for lead-free manufacturing and global regulatory considerations.

Why Choose EP4SE530H40C3G?

The EP4SE530H40C3G positions itself as a high-density Stratix IV FPGA option for designers who need large programmable logic capacity, substantial embedded memory, and a very high I/O count in a single surface-mount package. Its commercial-grade temperature range, RoHS compliance, and defined core supply window make it suitable for production systems where integration density and predictable electrical requirements are priorities.

This device is well suited for teams developing complex digital systems—such as networking equipment, signal-processing engines, and multi-channel data interfaces—that benefit from on-chip resources and the architectural capabilities documented in the Stratix IV device handbook.

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