EP4SE530H40C3N

The EP4SE530H40C3N is a STRATIX® IV E field-programmable gate array (FPGA) IC designed for high-density programmable logic and on‑chip memory integration. With 531,200 logic elements, approximately 28 Mbits of embedded RAM, and 976 general-purpose I/Os, it targets designs that require substantial logic capacity, extensive I/O connectivity, and significant embedded memory resources.

Packaged in a 1517-ball BGA (FCBGA) and specified for commercial-grade operation, this device is suited for surface-mount board-level integration where large-scale programmable logic is required within a defined voltage and temperature window.

Key Features

• Core Logic — 531,200 logic elements provide large-scale programmable logic capacity for complex digital designs.
• Embedded Memory — Approximately 28 Mbits of on-chip RAM to support buffering, data storage, and memory-intensive functions.
• I/O Density — 976 I/O pins to accommodate extensive multi-channel interfaces and dense peripheral connectivity.
• Power — Specified operating supply range of 870 mV to 930 mV to guide system power design and rails.
• Package & Mounting — 1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (42.5 × 42.5 mm); surface-mount mounting for standard PCB assembly flows.
• Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for typical commercial applications.
• Compliance — RoHS compliant for environmental and regulatory alignment in many commercial products.

Typical Applications

• High-density programmable logic — Implement large custom logic functions and algorithm acceleration using the device's 531,200 logic elements.
• Memory‑intensive processing — Leverage approximately 28 Mbits of embedded RAM for packet buffering, frame storage, or intermediate data pipelines.
• I/O-rich interface aggregation — Use 976 I/Os to consolidate multiple serial and parallel interfaces or to connect numerous sensors and peripherals.

Unique Advantages

• Large programmable capacity — The high logic element count enables integration of complex state machines, custom accelerators, and control logic on a single device, reducing board-level component count.
• Substantial on-chip memory — Approximately 28 Mbits of embedded RAM supports data buffering and local storage without immediate dependence on external memory.
• Extensive I/O support — 976 I/Os simplify system partitioning and reduce the need for external interface multiplexing or additional bridge devices.
• Compact BGA footprint — The 1517-ball FCBGA package (supplier 1517-HBGA, 42.5 × 42.5 mm) enables high-density PCB implementations while keeping routing and placement consolidated.
• Defined electrical window — A specified supply range of 870 mV to 930 mV allows predictable integration with system power rails and design margins.
• Regulatory alignment — RoHS compliance eases environmental conformity for commercial products.

Why Choose EP4SE530H40C3N?

The EP4SE530H40C3N positions itself as a high-capacity, commercially graded FPGA option for designs that demand large programmable logic, significant on-chip RAM, and a high pin count for connectivity. Its combination of 531,200 logic elements, approximately 28 Mbits of embedded memory, and 976 I/Os makes it suitable for consolidating complex digital functions onto a single programmable device.

This device is appropriate for customers building systems that require scalability in logic and memory resources, compact BGA packaging, and predictable electrical and thermal operating windows. Its RoHS compliance and surface-mount form factor support established production and regulatory workflows.

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