EP4SE530H40C4ES

IC FPGA 976 I/O 1517HBGA
Part Description

STRATIX® IV E Field Programmable Gate Array (FPGA) IC 976 28033024 531200 1517-BBGA, FCBGA

Quantity 701 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-HBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O976Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28033024

Overview of EP4SE530H40C4ES – STRATIX® IV E Field Programmable Gate Array (FPGA) IC

The EP4SE530H40C4ES is a Stratix® IV E FPGA device from Intel provided in a 1517-BBGA (FCBGA) package with a supplier package of 1517-HBGA (42.5×42.5). It delivers high-density programmable logic with 531,200 logic elements and extensive on-chip memory.

Designed for commercial-grade applications, this surface-mount FPGA offers a large I/O count and core supply operating range that support complex digital designs and memory-intensive functions. The Stratix IV device handbook referenced in the datasheet provides detailed specifications for PLLs, transceiver performance, DSP block behavior and TriMatrix memory blocks for system-level design reference.

Key Features

  • High-density logic — 531,200 logic elements for implementing large-scale programmable logic, complex state machines and deep datapaths.
  • Embedded memory — Approximately 28.03 Mbits of embedded memory to support buffering, on-chip datasets and state storage.
  • Extensive I/O — 976 I/O pins to accommodate dense board-level connectivity and multiple peripheral interfaces.
  • Package and mounting — 1517-BBGA (FCBGA) package, supplier device package 1517-HBGA (42.5×42.5), surface mount for compact system integration.
  • Core voltage — Core supply operating range from 870 mV to 930 mV to match specified power delivery designs.
  • Commercial operating range — Rated for 0 °C to 85 °C operating temperature; device grade: Commercial.
  • Design reference material — Stratix IV Device Handbook (Volume 4) coverage includes DC and switching characteristics, PLL specifications, DSP block specifications, TriMatrix memory block specifications, transceiver performance and configuration/JTAG details for design implementation.
  • RoHS compliant — Environmentally compliant manufacturing status.

Typical Applications

  • High-density digital systems — Use the device’s 531,200 logic elements to implement complex digital controllers, state machines and custom compute fabrics.
  • Memory-intensive designs — Approximately 28.03 Mbits of embedded memory supports buffering, look-up tables and on-chip data storage for real-time processing.
  • High-pin-count I/O systems — 976 I/Os enable integration with multiple peripherals, sensors and parallel interfaces on compact boards.

Unique Advantages

  • Large programmable fabric: 531,200 logic elements let you consolidate functions on a single device and reduce external glue logic.
  • Substantial on-chip memory: Approximately 28.03 Mbits of embedded RAM supports data buffering and reduces the need for external memory in many applications.
  • High I/O capacity: 976 I/Os provide flexibility to route extensive external interfaces without multiplexing compromises.
  • Comprehensive design documentation: The Stratix IV Device Handbook includes electrical, switching, PLL, DSP and transceiver specifications to guide system integration.
  • Commercial-grade deployment: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product lines.

Why Choose EP4SE530H40C4ES?

The EP4SE530H40C4ES positions itself as a high-density Stratix IV E FPGA option for commercial applications requiring significant on-chip logic, large embedded memory and a high I/O count. Its documented device handbook coverage for core performance, PLLs, DSP blocks, TriMatrix memory and transceiver performance supports systematic integration and verification.

This device is suited to design teams consolidating complex logic and memory functions onto a single surface-mount FCBGA package, providing a balance of integration density, documented device behavior and environmental compliance for commercial deployments.

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