EP4SE530H35I4G

IC FPGA 744 I/O 1152HBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 118 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-HBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits28033024

Overview of EP4SE530H35I4G – Field Programmable Gate Array (FPGA) IC

The EP4SE530H35I4G is an Intel programmable logic device from the Stratix IV family presented as a high-density FPGA IC for industrial-grade applications. It combines a large programmable fabric with on-chip memory and advanced I/O capability to support complex logic, interface, and signal-processing tasks.

Designed for industrial environments, the device targets designs that require significant logic capacity, substantial embedded memory, and high I/O density while operating across an industrial temperature range and narrow core voltage window.

Key Features

  • Programmable Fabric Approximately 531,200 logic elements providing substantial capacity for custom logic implementation and complex designs.
  • Embedded Memory Approximately 28.0 Mbits of on-chip RAM to support large buffering, state tables, and memory-intensive functions.
  • I/O Density 744 user I/O pins to support wide external interfacing and high signal-count designs.
  • Stratix IV Family Architecture Device documentation and feature set reference Stratix IV capabilities such as embedded memory, DSP blocks, clock networks, PLLs, and high-speed transceiver and I/O features.
  • Power and Supply Core operating voltage range specified at 870 mV to 930 mV for the device core supply.
  • Package and Mounting Available in a 1152-ball BGA/FCBGA-style package with supplier device package 1152-HBGA (42.5 × 42.5 mm); surface-mount mounting type.
  • Industrial Temperature Range Rated for operation from −40 °C to 100 °C suitable for industrial applications.
  • Regulatory RoHS compliant.

Typical Applications

  • High-speed serial and protocol bridging Use of the device’s documented high-speed transceiver and I/O features to implement serial links and protocol adapters.
  • External memory interfaces Implement controllers and interface logic leveraging the device’s support for external memory interfaces.
  • Digital signal processing Deploy DSP blocks and on-chip memory for algorithm acceleration and signal-processing pipelines.
  • Industrial control and automation Industrial-grade temperature rating and high I/O count make the device suitable for control, monitoring, and I/O aggregation in industrial systems.

Unique Advantages

  • Large programmable capacity: Approximately 531,200 logic elements enable implementation of complex custom logic and large-scale designs without immediate escalation to multiple devices.
  • Substantial on-chip memory: Approximately 28.0 Mbits of embedded RAM reduces reliance on external memory for many buffering and state-storage needs.
  • High I/O count: 744 I/O pins provide connectivity for dense peripheral, sensor, and interface requirements.
  • Industrial temperature support: Operation from −40 °C to 100 °C supports deployment in industrial environments with extended temperature variation.
  • Compact BGA package: 1152-ball HBGA (42.5 × 42.5 mm) surface-mount packaging balances I/O density and board-level integration.
  • Architecture-level feature set: Stratix IV family features such as DSP blocks, PLLs, clock networks, and high-speed I/O provide architectural building blocks for performance-oriented designs.

Why Choose EP4SE530H35I4G?

The EP4SE530H35I4G positions itself as a high-density, industrial-grade Stratix IV FPGA option combining extensive logic resources, significant embedded memory, and abundant I/O in a compact BGA package. Its documented family features—DSP blocks, clock networks, PLLs, and high-speed transceiver/I/O capabilities—make it suited to engineers implementing complex logic, high-bandwidth interfaces, and DSP workloads within industrial temperature environments.

This device is appropriate for teams seeking a single-device solution that offers scaleable programmable capacity, strong on-chip memory resources, and a high pin count for dense system integration, all backed by Stratix IV device documentation.

Request a quote or submit a procurement inquiry to obtain pricing, lead time, and availability for the EP4SE530H35I4G.

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