EP4SE530H35I3

The EP4SE530H35I3 is an Intel STRATIX® IV E field programmable gate array (FPGA) delivering high-density programmable logic and on-chip memory in a compact BGA package. It targets designs that require large logic capacity, substantial embedded memory, and extensive I/O connectivity.

Key device metrics include 531,200 logic elements, approximately 28 Mbits of embedded memory, and 744 I/Os. The device is supplied in a 1152-BBGA (FCBGA) package, operates from 870 mV to 930 mV core voltage, and is rated for industrial temperature operation from −40°C to 100°C.

Key Features

• Core Logic 531,200 logic elements providing high-density programmable fabric for complex digital implementations.
• Embedded Memory Approximately 28 Mbits of on-chip RAM (28,033,024 bits) for buffering, FIFOs, and local data storage without immediate reliance on external memory.
• I/O Capacity 744 I/Os to support extensive peripheral connectivity, multi-channel interfacing, and board-level integration.
• Power Core voltage range of 870 mV to 930 mV for defined power-supply planning and integration into system power architectures.
• Package and Mounting 1152-BBGA (FCBGA) package; supplier package listed as 1152-HBGA (42.5×42.5). Surface-mount design for compact PCB implementation.
• Temperature and Grade Industrial-grade device with an operating temperature range of −40°C to 100°C for extended-environment deployments.
• Environmental Compliance RoHS compliant to meet lead-free assembly and environmental requirements.

Typical Applications

• High-density processing and logic consolidation — Leverage 531,200 logic elements to integrate multiple functions or large state machines into a single FPGA.
• Memory-intensive on-chip buffering — Approximately 28 Mbits of embedded RAM supports packet buffering, FIFOs, and temporary data storage without immediate external memory.
• Dense I/O systems and protocol interfacing — 744 I/Os facilitate multi-channel interfaces, board-level peripheral aggregation, and complex interconnect schemes.
• Industrial control and instrumentation — Industrial temperature rating and robust BGA packaging suit factory automation, control systems, and instrumentation applications.

Unique Advantages

• High logic capacity: 531,200 logic elements enable consolidation of complex functions into a single device, reducing component count.
• Substantial on-chip memory: Approximately 28 Mbits of embedded RAM lowers dependency on external memory, simplifying BOM and PCB routing.
• Large I/O complement: 744 I/Os provide versatility for connecting numerous peripherals and supporting multi-protocol designs.
• Industrial temperature range: −40°C to 100°C operation supports deployment in extended-environment and industrial applications.
• Compact, high-pin-count package: 1152-BBGA / 1152-HBGA (42.5×42.5) balances high-density I/O with a compact board footprint.
• Defined core voltage range: 870 mV–930 mV simplifies power-supply selection and integration into regulated power domains.

Why Choose EP4SE530H35I3?

The EP4SE530H35I3 positions itself as a high-capacity, industrial-grade FPGA option for designs that demand large programmable logic resources, significant on-chip memory, and extensive I/O. Its combination of 531,200 logic elements, approximately 28 Mbits of embedded RAM, and 744 I/Os enables consolidation of complex digital subsystems into a single, surface-mount BGA device.

This device is suited for engineers and procurement teams building dense, memory-aware, and I/O-rich systems in environments requiring industrial temperature operation. Its package and electrical specifications support compact board-level integration while providing predictable power and thermal planning inputs.

Request a quote or submit a request for pricing to evaluate the EP4SE530H35I3 for your next design project.