EP4SE530H35C4ES

The EP4SE530H35C4ES is a STRATIX® IV E field programmable gate array (FPGA) IC designed for high-density digital designs. It integrates 531,200 logic elements and approximately 28 Mbits of embedded memory to support complex logic, buffering, and data-path implementations.

With a high I/O count and a compact FCBGA surface-mount package, this commercial-grade FPGA is aimed at designs that demand large logic capacity and substantial on-chip memory within a single-chip programmable platform.

Key Features

• Core Logic 531,200 logic elements to implement large-scale digital designs and complex logic functions.
• Embedded Memory Approximately 28 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive algorithms.
• I/O Capacity 744 user I/O pins to accommodate high-channel-count interfaces and broad system connectivity.
• Package & Mounting 1152-BBGA (FCBGA) surface-mount package; supplier package dimension listed as 1152-HBGA (42.5 × 42.5 mm) for compact board-level integration.
• Power Core supply range specified at 870 mV to 930 mV for targeted power-domain design and supply planning.
• Operating Range Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Regulatory RoHS compliant.

Typical Applications

• High-density digital processing — Implements wide datapaths and complex control logic using the large logic-element count and embedded memory.
• High-channel I/O systems — Supports applications requiring many parallel interfaces or channelized connectivity with 744 I/Os.
• Memory-intensive logic — On-chip RAM enables buffering, large FIFOs, and state storage for streaming or packet processing tasks.
• Prototyping and system integration — Surface-mount FCBGA package and extensive resources make it suitable for board-level integration and prototype platforms.

Unique Advantages

• High logic capacity: 531,200 logic elements support large-scale, complex designs without immediate need for multi-chip partitioning.
• Substantial embedded memory: Approximately 28 Mbits of on-chip RAM reduces dependence on external memory for many buffering and data-path needs.
• Extensive I/O resources: 744 I/Os allow flexible interfacing to numerous peripherals and high-channel-count front-ends.
• Compact FCBGA package: 1152-BBGA package with a 42.5 × 42.5 mm footprint enables dense board layouts while maintaining high pin count.
• Low-voltage core operation: 870–930 mV supply range allows precise power planning for the FPGA core domain.
• Commercial-grade and RoHS compliant: Meets RoHS requirements and operates across a commercial temperature range for a wide set of standard applications.

Why Choose EP4SE530H35C4ES?

The EP4SE530H35C4ES positions itself as a high-capacity, memory-rich FPGA option for designers who need significant on-chip resources and extensive I/O in a single, surface-mount FCBGA package. Its combination of 531,200 logic elements, approximately 28 Mbits of embedded RAM, and 744 I/Os supports complex system functions while simplifying board-level integration.

This device is well suited to engineering teams developing large digital systems, high-channel-count interfaces, or memory-heavy designs that benefit from consolidated programmable logic. The commercial-grade operating range and RoHS compliance help streamline adoption into standard product lines and development projects.

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