EP4SE530H35C4G

IC FPGA 744 I/O 1152HBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 97 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-HBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits28033024

Overview of EP4SE530H35C4G – Field Programmable Gate Array (FPGA) IC

The EP4SE530H35C4G is an Intel Stratix IV family FPGA offering high logic capacity and extensive on-chip memory in a surface-mount FCBGA package. Designed for high-bandwidth, compute-intensive designs, the device targets applications that require large numbers of logic elements, many I/Os, and substantial embedded memory.

With 531,200 logic elements, approximately 28 Mbits of embedded memory, and 744 I/O pins, this commercial-grade FPGA delivers the integration and I/O density needed for advanced communication, signal processing, and system-integration tasks while operating within a 0 °C to 85 °C environment and a core voltage range of 870 mV to 930 mV.

Key Features

  • Core Capacity — 531,200 logic elements provide large programmable fabric for complex logic, state machines, and custom datapaths.
  • Embedded Memory — Approximately 28 Mbits of on-chip RAM supports large buffering, on-chip datasets, and memory-intensive algorithms.
  • I/O Density — 744 I/O pins enable broad external connectivity and support for multiple parallel interfaces or high-pin-count external devices.
  • Package and Mounting — 1152-BBGA / 1152-HBGA FCBGA package (42.5 × 42.5 mm) in a surface-mount form factor for compact board integration.
  • Power and Voltage — Core supply range from 870 mV to 930 mV to match system power-rail requirements for Stratix IV devices.
  • Temperature and Grade — Commercial grade operation from 0 °C to 85 °C, suitable for controlled-environment embedded systems.
  • Compliance — RoHS-compliant construction to support modern manufacturing and environmental requirements.
  • Stratix IV Family Documentation — Device is part of the Stratix IV device family with detailed architecture and transceiver information available in the Stratix IV Device Handbook.

Typical Applications

  • High-performance networking — Use the device's large logic capacity and high I/O count to implement packet processing, protocol offload, and aggregation functions.
  • Digital signal processing — Substantial embedded memory and Stratix IV architecture support complex filtering, FFTs, and real-time algorithm acceleration.
  • High-speed interface controllers — High I/O density and Stratix IV transceiver family features enable implementation of multi-lane SERDES, memory controllers, and custom bus bridges.
  • Video and imaging systems — On-chip RAM and abundant logic elements allow frame buffering, pixel processing pipelines, and format conversion blocks.

Unique Advantages

  • Highly scalable logic capacity: 531,200 logic elements enable implementation of large, complex designs without external logic expansion.
  • Substantial on-chip memory: Approximately 28 Mbits of embedded RAM reduces dependence on external memory for buffering and accelerates data paths.
  • Exceptional I/O resources: 744 I/Os provide flexibility to interface with multiple peripherals, high-pin-count memories, and multi-lane links.
  • Compact, manufacturable package: 1152-HBGA (42.5 × 42.5 mm) FCBGA in a surface-mount format supports dense board integration and automated assembly.
  • Designed for high-bandwidth designs: As part of the Stratix IV family, the device aligns with documented high-speed transceiver and bandwidth-focused architecture features.
  • RoHS compliant and commercial-grade: Helps meet environmental requirements while serving a broad range of controlled-environment embedded applications.

Why Choose EP4SE530H35C4G?

The EP4SE530H35C4G balances extensive programmable logic, significant embedded memory, and high I/O density within a compact FCBGA package—making it suitable for demanding communication, signal-processing, and interface-centric designs. Backed by the Stratix IV device documentation from Intel, this FPGA provides the architecture-level details engineers need to architect and optimize high-performance systems.

Choose this device when your design requires a high logic count, substantial on-chip RAM, and many external connections in a commercial-temperature, RoHS-compliant FPGA solution.

Request a quote or submit an RFQ to obtain pricing, availability, and lead-time information for EP4SE530H35C4G.

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