EP4SE530H35C3G

IC FPGA 744 I/O 1152HBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 527 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-HBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits28033024

Overview of EP4SE530H35C3G – Field Programmable Gate Array (FPGA) IC

The EP4SE530H35C3G is an Intel Stratix IV family FPGA offering high logic capacity and extensive on-chip resources for demanding digital designs. It provides 531,200 logic elements and approximately 28 Mbits of embedded memory for packet processing, signal processing, and high-density interfacing tasks.

Built on the Stratix IV architecture described in the device handbook, this device combines a large logic fabric with high I/O count and on-chip features such as DSP blocks, PLLs, clock networks and high-speed transceiver support to address high-throughput and integration-focused applications.

Key Features

  • Logic Capacity — 531,200 logic elements and 21,248 logic array blocks (CLBs) provide extensive programmable fabric for complex logic and parallel processing.
  • Embedded Memory — Approximately 28 Mbits of on-chip RAM to support buffering, lookup tables, and on-chip data storage.
  • I/O and Packaging — 744 user I/O pins in a surface-mount 1152-BBGA / 1152-HBGA package (42.5 × 42.5 mm) for high-density board integration.
  • Stratix IV Architecture Features — Device handbook lists DSP blocks, PLLs, clock networks, external memory interface capability, and high-speed transceiver features intended for wide protocol and bandwidth support.
  • Power and Voltage — Core voltage specified at 870 mV to 930 mV (0.87–0.93 V) to match low-voltage power domains.
  • Commercial Temperature and Compliance — Commercial-grade device rated for 0 °C to 85 °C and RoHS compliant for regulated assembly environments.

Typical Applications

  • High‑throughput Networking — Packet processing and protocol bridging where large logic arrays and high I/O density are required.
  • Digital Signal Processing — DSP-focused designs that leverage on-chip DSP resources and significant embedded RAM for streaming algorithms.
  • High-speed Interface Controllers — FPGA-based controllers and protocol engines using the Stratix IV transceiver and external memory interface features.
  • Advanced Instrumentation — Test and measurement systems that require parallel processing, large on-chip memory, and many I/O channels.

Unique Advantages

  • High logic density: 531,200 logic elements enable implementation of complex state machines, pipelines, and parallel data paths without external logic.
  • Substantial on‑chip RAM: Approximately 28 Mbits of embedded memory reduces dependence on external DRAM for many buffering and lookup needs.
  • High I/O count in compact package: 744 I/O in a 1152‑HBGA (42.5 × 42.5 mm) surface-mount package supports dense board-level connectivity.
  • Stratix IV feature set: Architecture-level support for DSP blocks, PLLs, clock networks and high-speed transceivers provides the building blocks for bandwidth- and timing-sensitive designs.
  • Low-voltage core compatibility: Core supply of 0.87–0.93 V aligns with modern low-voltage power domains for efficient power budgeting.
  • Commercial-grade availability: Rated for 0 °C to 85 °C and RoHS compliant for mainstream electronic product development.

Why Choose EP4SE530H35C3G?

The EP4SE530H35C3G positions itself as a high-capacity Stratix IV FPGA well suited to designs that demand large programmable logic, significant on-chip memory, and high I/O density. Its combination of logic elements, embedded RAM and architecture-level features supports applications in networking, signal processing, and complex interface control.

For engineering teams building high-throughput systems, this device offers a balance of integration and board-level density while providing the Stratix IV feature set referenced in the device handbook to help with timing, clocking, and transceiver-centric designs.

Request a quote or submit an inquiry for EP4SE530H35C3G to receive pricing and availability information from our sales team.

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