EP4SE530H35C3ES

The EP4SE530H35C3ES is a STRATIX® IV E Field Programmable Gate Array (FPGA) IC from Intel, delivering large on-chip logic capacity and memory in a compact ball-grid package. It targets designs that require high logic density, substantial embedded memory, and a high count of I/O for dense system integration.

Key Features

• Logic Capacity  Provides 531,200 logic elements to implement complex digital functions and custom processing pipelines on a single device.
• Embedded Memory  Contains approximately 28 Mbits of on-chip RAM (28,033,024 bits) to support buffering, FIFOs, and local data storage requirements.
• I/O Density  Offers 744 user I/O pins to interface directly with a wide range of peripherals and high-pin-count subsystems.
• Power and Core Voltage  Operates with a core supply range of 870 mV to 930 mV, suitable for designs optimized for low-voltage FPGA cores.
• Package and Mounting  Delivered in a 1152-BBGA FCBGA package (supplier package listed as 1152-HBGA, 42.5 × 42.5 mm) with surface-mount mounting for compact board layouts.
• Operating Range and Grade  Rated for commercial operation from 0 °C to 85 °C and designated as Commercial grade.
• Environmental Compliance  RoHS compliant to meet common environmental and regulatory requirements.

Typical Applications

• High-density digital processing  Leverage 531,200 logic elements to implement custom accelerators, signal processing pipelines, and complex state machines on-chip.
• Data buffering and local storage  Use approximately 28 Mbits of embedded RAM for packet buffering, FIFOs, and temporary data storage without external memory.
• High-pin-count system interfaces  744 I/O pins enable direct connection to multiple peripherals, parallel buses, and high-throughput interface hubs.
• Compact board designs  Surface-mount 1152-BBGA (42.5 × 42.5 mm) package supports dense PCB layouts where board area and routing efficiency are priorities.

Unique Advantages

• High on-chip integration: 531,200 logic elements and substantial embedded RAM reduce reliance on external components, simplifying system BOM and layout.
• Large embedded memory: Approximately 28 Mbits of on-chip RAM enable significant local buffering and data handling without immediate external memory needs.
• Extensive I/O capacity: 744 I/O pins provide flexibility to interface multiple subsystems and support high-bandwidth connectivity options.
• Compact FCBGA packaging: The 1152-ball FCBGA (42.5 × 42.5 mm) offers a space-efficient footprint for high-density designs.
• Low-voltage core operation: A core voltage range of 0.87–0.93 V supports designs targeting low-voltage FPGA operation and power-optimized architectures.
• Regulatory compliance: RoHS compliance supports environmentally conscious product development and regulatory alignment.

Why Choose EP4SE530H35C3ES?

The EP4SE530H35C3ES combines large logic capacity, significant embedded memory, and a high I/O count within a compact 1152-BBGA FCBGA package, making it well suited for commercial designs that demand on-chip integration and dense interfacing. Manufactured by Intel and rated for commercial temperature operation, it provides a foundation for complex digital systems that require sizeable programmable resources and local memory.

Designers seeking to consolidate functions onto a single FPGA, reduce external component count, and support high-pin-count connectivity will find the EP4SE530H35C3ES appropriate for their projects.

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