EP4SE530H35C2N

The EP4SE530H35C2N is a Stratix IV E field programmable gate array (FPGA) in a 1152-ball BGA package. It integrates a high-density logic fabric with substantial embedded memory and a large I/O count for complex system integration.

Built on the Stratix IV device architecture, the device targets data‑centric and interface‑intensive applications that benefit from abundant logic resources, approximately 28 Mbits of embedded RAM, and support for high‑pin‑count designs. The device is RoHS compliant and supplied in a surface‑mount 1152‑HBGA (42.5 × 42.5 mm) package.

Key Features

• Logic Capacity — 531,200 logic elements providing high logic density for large-scale FPGA designs.
• Embedded Memory — Approximately 28 Mbits of on‑chip RAM to support frame buffers, FIFOs, and local data storage.
• I/O Count — 744 user I/O pins to accommodate wide external interfaces and multiple high‑pin connectors.
• Device Architecture — Stratix IV E family architecture with documented features including embedded memory, DSP blocks, clock networks, PLLs, and high‑speed I/O (per device handbook).
• Package & Mounting — 1152‑BBGA FCBGA / supplier package 1152‑HBGA (42.5 × 42.5 mm); surface mount for PCB assembly.
• Power Supply Range — Core voltage specified from 870 mV to 930 mV to match system power rails.
• Operating Temperature — Commercial grade operation from 0 °C to 85 °C.
• Regulatory — RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• High‑performance data processing — Large logic capacity and abundant embedded memory support complex algorithms and parallel processing tasks.
• Communications and networking — High I/O count and Stratix IV E architecture features suit protocol bridging, packet processing, and interface aggregation.
• Signal processing and DSP — On‑chip memory and architecture elements outlined in the device handbook make the device suitable for DSP pipelines and buffering.
• Interface and board‑level controllers — Surface‑mount BGA package and extensive I/O enable integration as a system controller or protocol hub on multi‑board systems.

Unique Advantages

• High logic density: 531,200 logic elements allow consolidation of multiple functions into a single device, reducing board count and BOM complexity.
• Substantial embedded memory: Approximately 28 Mbits of on‑chip RAM provide local storage for buffering, frame memory, and temporary data retention without external RAM.
• Large I/O availability: 744 I/O pins enable extensive external connectivity and flexibility for multi‑interface designs.
• Robust packaging for high‑pin designs: 1152‑HBGA package (42.5 × 42.5 mm) supports dense routing and high signal count on modern PCBs.
• Commercial operating range: Qualified for 0 °C to 85 °C operation, matching typical commercial electronics deployment scenarios.
• RoHS compliance: Enables use in products targeting markets and manufacturers that require RoHS‑compliant components.

Why Choose EP4SE530H35C2N?

The EP4SE530H35C2N positions itself as a high‑capacity, architecture‑rich FPGA option within the Stratix IV E family for designs that demand large logic resources, significant on‑chip memory, and broad I/O capability. Its package and pin count make it suitable for systems where integration density and multiple external interfaces are priorities.

This device is well suited for development teams and OEMs building data‑intensive, interface‑driven systems that require scalability and a mature device architecture documented in the Stratix IV device handbook. Its combination of logic capacity, embedded memory, and I/O availability offers long‑term flexibility for evolving hardware requirements.

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