EP4SE530F43I4G

The EP4SE530F43I4G is an Intel Stratix IV family Field Programmable Gate Array (FPGA) IC designed for high-density, system-level integration. It combines a large programmable fabric with extensive on-chip memory and I/O to address demanding digital logic and data-path applications.

Targeted at industrial applications, the device provides 531,200 logic elements, approximately 28 Mbits of embedded memory, and 1,120 I/O pins in a 1760-FCBGA surface-mount package, supporting deployment across robust temperature ranges and low-voltage power domains.

Key Features

• Core Capacity — 531,200 logic elements provide a high-density programmable fabric for complex logic, control, and data-processing functions.
• Embedded Memory — Approximately 28 Mbits of on-chip RAM to support large buffers, FIFOs, and intermediate data storage without relying exclusively on external memory.
• I/O and System Interfaces — 1,120 I/O pins enable dense board-level connectivity and support for multiple external interfaces and memory buses.
• Stratix IV Architecture Features — As a Stratix IV device, the part includes architecture-level items such as embedded DSP blocks, PLLs, clock networks, and high-speed transceiver and I/O features as described in the device handbook.
• Power and Voltage — Core supply range specified at 870 mV to 930 mV to match modern low-voltage power domains.
• Package and Mounting — 1760-ball FCBGA (42.5 × 42.5 mm) surface-mount package for high-pin-count board designs.
• Industrial Temperature Grade — Specified operating range from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance — RoHS-compliant manufacturing and materials.

Typical Applications

• High-speed networking and telecommunications — Use the device’s Stratix IV transceiver and I/O features together with large logic capacity for packet processing, protocol handling, and data-path acceleration.
• Digital signal processing and acceleration — Leverage embedded memory and on-chip DSP capabilities for real-time signal processing, filtering, and algorithm acceleration.
• External memory controllers and interfaces — Combine the abundant I/O and clocking resources with the device’s architecture to implement external memory interfaces and high-bandwidth buffer management.
• Complex system integration and prototyping — High logic count and dense I/O make the device suitable for integrating multiple subsystems, bridging interfaces, and validating system-level designs.

Unique Advantages

• Highly integrated logic and memory: 531,200 logic elements and approximately 28 Mbits of embedded memory reduce dependence on external components and simplify board-level design.
• Extensive I/O capacity: 1,120 I/O pins support dense connectivity for multi-channel interfaces and complex peripheral integration.
• Industrial-grade thermal range: −40 °C to 100 °C operating temperature enables use in environments that require extended temperature tolerance.
• Optimized for low-voltage systems: Core voltage range of 870 mV–930 mV aligns with modern low-voltage power architectures to support efficient system power design.
• Compact, high-pin-count package: 1760-FCBGA (42.5 × 42.5 mm) offers a small board footprint relative to the device’s capacity for space-constrained applications.
• Standards-aware manufacturing: RoHS compliance supports environmentally conscious designs and regulatory adherence.

Why Choose EP4SE530F43I4G?

The EP4SE530F43I4G delivers a combination of high logic capacity, substantial on-chip memory, and a very large I/O complement in a compact FCBGA package—making it suitable for engineers building high-bandwidth, highly integrated digital systems. Its Stratix IV architecture features (including DSP, clocking, PLLs, and high-speed I/O capabilities documented in the device handbook) enable flexible implementation of protocol-handling, signal-processing, and memory-interface functions.

This device is well suited to teams needing a robust, industrial-temperature FPGA platform that scales for complex designs while supporting modern low-voltage power domains and dense board-level integration.

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