EP4SE530F43I3N

IC FPGA 1120 I/O 1760FBGA
Part Description

STRATIX® IV E Field Programmable Gate Array (FPGA) IC 1120 28033024 531200 1760-BBGA, FCBGA

Quantity 17 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O1120Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28033024

Overview of EP4SE530F43I3N – STRATIX® IV E FPGA, 1760-FCBGA (42.5×42.5)

The EP4SE530F43I3N is an Intel STRATIX IV E field-programmable gate array supplied in a 1760-FCBGA (42.5 × 42.5 mm) package for surface-mount assembly. This high-density FPGA integrates a large logic fabric, abundant embedded memory and a broad I/O count to support complex programmable logic, signal processing and system integration tasks.

Targeted at industrial-grade applications, the device offers a wide operating temperature range and low-voltage core operation, delivering a combination of performance and thermal margin suitable for demanding embedded and communications designs.

Key Features

  • High-density logic fabric — 531,200 logic elements to implement large-scale digital designs and complex state machines.
  • Embedded memory — Approximately 28 Mbits of on-chip RAM to support buffering, packet processing and data-path storage without external memory for many use cases.
  • Extensive I/O — 1,120 user I/O pins to interface with high-pin-count peripherals, multi-lane interfaces and large connector ecosystems.
  • Core voltage — Supports a defined core supply range of 870 mV to 930 mV for consistent power planning and thermal design.
  • Package and mounting — 1760-BBGA (FCBGA) surface-mount package in a 42.5 × 42.5 mm footprint for high-pin-count board-level integration.
  • Industrial temperature grade — Rated for operation from −40 °C to 100 °C, suitable for industrial environments with elevated thermal requirements.
  • Standards and documentation — Device details and performance characteristics are documented in the Stratix IV Device Handbook, which includes DC/switching characteristics, PLL, transceiver, DSP block and memory block specifications.
  • RoHS compliant — Conforms to RoHS environmental requirements for lead-free assembly and regulatory compliance.

Typical Applications

  • High-performance signal processing — Implement DSP pipelines and custom arithmetic blocks using the device’s large logic capacity and documented DSP block specifications.
  • Communications and networking — Support multi-lane interfaces and protocol processing with abundant I/O and on-chip memory for buffering and packet handling.
  • Industrial control systems — Use the industrial temperature rating and robust core supply window for motor control, machine automation and factory instrumentation designs.
  • Embedded compute and prototyping — Leverage the sizable logic and memory resources to prototype complex SoC functions or offload compute tasks from host processors.

Unique Advantages

  • Large logic capacity: 531,200 logic elements enable implementation of complex state machines, accelerators and custom datapaths on a single device.
  • Significant embedded memory: Approximately 28 Mbits of on-chip RAM reduces dependence on external memory for many buffering and real-time data tasks, simplifying BOM and board layout.
  • High I/O count: 1,120 I/Os provide flexibility for multi-interface boards and high-pin-count peripheral connectivity without external multiplexing.
  • Industrial temperature range: Rated −40 °C to 100 °C to meet the thermal needs of demanding industrial deployments.
  • Documented subsystem specifications: The Stratix IV device handbook provides detailed specs for power, PLLs, transceivers, DSP blocks, TriMatrix memory blocks and configuration interfaces to aid system design and verification.
  • RoHS compliant packaging: Facilitates lead-free manufacturing and regulatory compliance in commercial production.

Why Choose EP4SE530F43I3N?

The EP4SE530F43I3N positions itself as a high-capacity, industrial-grade FPGA option for designers who need substantial programmable logic, on-chip memory and a large number of I/Os in a single, surface-mount FCBGA package. Its documented subsystem specifications (PLL, transceiver, DSP and memory blocks) and broad operating temperature make it suitable for complex embedded, communications and industrial control applications.

This device is well-suited for development teams and procurement groups seeking a scalable FPGA platform that combines integration, proven documentation and environmental compliance to support medium- to high-complexity designs.

Request a quote or submit a procurement inquiry to receive pricing and availability for the EP4SE530F43I3N.

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