EP4SE530H35C3N

The EP4SE530H35C3N is a STRATIX® IV E Field Programmable Gate Array (FPGA) IC delivering very high programmable logic capacity and on-chip memory in a compact BGA package. With 531,200 logic elements, approximately 28 Mbits of embedded memory and 744 I/Os, this device targets designs that require high logic density, substantial embedded RAM and large I/O counts while maintaining a compact surface-mount footprint.

Packaged in a 1152-ball BGA (FCBGA / supplier package 1152-HBGA, 42.5 × 42.5 mm) and rated for commercial operation (0 °C to 85 °C), the EP4SE530H35C3N operates from a core voltage supply of 870 mV to 930 mV and is RoHS compliant.

Key Features

• Core logic capacity — 531,200 logic elements provide extensive programmable resources for complex designs and high-density implementations.
• Embedded memory — Approximately 28 Mbits of on-chip RAM to support buffering, packet storage, and stateful processing without external memory for many functions.
• I/O density — 744 I/O pins enable broad external connectivity for interfaces, peripherals and multi-channel systems.
• Power — Core voltage supply range of 870 mV to 930 mV for the device core, enabling predictable supply design.
• Package and mounting — 1152-BBGA FCBGA package (supplier package: 1152-HBGA, 42.5 × 42.5 mm) with surface-mount mounting for compact board integration.
• Operating conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C to suit standard commercial applications.
• Environmental — RoHS compliant to meet lead-free manufacturing and environmental requirements.

Unique Advantages

• High logic density: 531,200 logic elements enable consolidation of complex functions into a single FPGA, reducing board-level component count.
• Substantial on-chip memory: Approximately 28 Mbits of embedded RAM supports data buffering and local storage, lowering dependence on external memory.
• Extensive I/O capability: 744 I/Os provide flexibility for multi-channel interfacing and integration of numerous peripherals and interfaces.
• Compact, surface-mount BGA package: 1152-ball FCBGA/HBGA footprint (42.5 × 42.5 mm supplier package) enables high-density board integration while maintaining thermal and mechanical robustness for surface-mount assembly.
• Commercial temperature rating and RoHS compliance: Commercial operating range (0 °C to 85 °C) combined with RoHS compliance simplifies adoption in standard commercial products and assemblies.
• Predictable core supply: Defined core voltage window (870–930 mV) supports consistent power-system design and margining.

Why Choose EP4SE530H35C3N?

EP4SE530H35C3N is positioned for applications that require high programmable logic capacity, large on-chip memory and extensive I/O in a compact BGA form factor. Its combination of 531,200 logic elements, approximately 28 Mbits of embedded RAM and 744 I/Os makes it suitable for consolidating complex digital functions onto a single FPGA while maintaining a predictable power and thermal profile.

As a commercial-grade, RoHS-compliant device available in a 1152-ball surface-mount package, the EP4SE530H35C3N offers a practical balance of density, connectivity and manufacturability for designers focused on scalable, high-capacity FPGA solutions.

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