EP4SE530H40C2
| Part Description |
STRATIX® IV E Field Programmable Gate Array (FPGA) IC 976 28033024 531200 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,064 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-HBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 976 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4SE530H40C2 – STRATIX® IV E FPGA, 531,200 Logic Elements
The EP4SE530H40C2 is a STRATIX® IV E field-programmable gate array (FPGA) in a 1517-BBGA FCBGA package, offering a high-density programmable fabric for demanding logic and system integration tasks. As a member of the Stratix IV family, the device provides architecture features such as high-speed transceiver support, extensive embedded memory, DSP resources and flexible I/O suitable for high-bandwidth, protocol-rich applications.
With 531,200 logic elements, approximately 28 Mbits of on-chip RAM, and up to 976 I/Os, this commercial-grade FPGA is positioned for advanced communications, networking, data-acceleration and high-density signal processing designs that require high integration and configurable system-level functionality.
Key Features
- Logic Capacity — 531,200 logic elements suitable for large, complex designs and high-density implementation of custom logic and control functions.
- Embedded Memory — Total on-chip RAM of 28,033,024 bits (approximately 28 Mbits) to support buffers, large state machines and memory-intensive functions.
- I/O Density — Up to 976 I/Os to accommodate broad connectivity and multiple external interface lanes.
- High-Speed Architecture Features — Stratix IV series architecture includes high-speed transceiver and data-bandwidth features indicated in the device handbook for protocol-rich and high-throughput designs.
- DSP and System Resources — Family documentation lists dedicated DSP blocks and clocking resources (PLLs and clock networks) that support signal processing and synchronous system designs.
- Power and Supply — Core voltage supply range of 870 mV to 930 mV that defines power-supply requirements for the FPGA core.
- Package & Mounting — 1517-BBGA, FCBGA package with supplier package reference 1517-HBGA (42.5 × 42.5 mm); surface-mount device for standard PCB assembly.
- Commercial Grade & Temperature Range — Rated for commercial operation from 0 °C to 85 °C.
- Environmental Compliance — RoHS compliant.
Typical Applications
- High-speed networking and communications — Use the device’s high I/O count and Stratix IV family transceiver and bandwidth features to implement protocol engines and packet processing.
- Data acceleration and signal processing — Large logic capacity and on-chip RAM support complex DSP pipelines and accelerator functions.
- External memory controller and interface — On-chip resources and I/O density enable implementation of external memory interfaces and buffering logic.
- High-density embedded systems — Integrate multiple system functions on a single FPGA to reduce board-level complexity and support configurable system designs.
Unique Advantages
- High integration density: 531,200 logic elements and approximately 28 Mbits of embedded memory allow consolidation of large designs into a single device, reducing BOM and interconnect complexity.
- Extensive I/O support: Up to 976 I/Os provide flexibility to connect multiple external interfaces, lanes and memory buses without additional bridging components.
- Family-level high-speed features: Stratix IV device handbook highlights transceiver, clocking and high aggregate bandwidth capabilities that support protocol-rich and throughput-centric designs.
- Surface-mount FCBGA package: 1517-BBGA/1517-HBGA (42.5 × 42.5 mm) packaging supports compact board layouts while accommodating the device’s pin count and thermal needs.
- Commercial temperature rating: Rated 0 °C to 85 °C for use in standard commercial applications where this operating range is appropriate.
- Regulatory compliance: RoHS compliance supports environmental requirements for lead-free manufacturing.
Why Choose EP4SE530H40C2?
The EP4SE530H40C2 combines the Stratix IV E family’s architecture-level features with a very large logic resource pool and substantial embedded memory, making it well suited for designers who need to implement high-density logic, memory buffering and complex protocol handling in a single FPGA. Its package options and high I/O count enable compact system integration while supporting multiple external interfaces.
This device is a practical choice for teams developing high-bandwidth communications, data-acceleration and signal-processing systems that require the integration of substantial logic and memory resources with robust clocking and transceiver-capable architecture as described in the Stratix IV device handbook.
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