EP4SE530H40C2

IC FPGA 976 I/O 1517HBGA
Part Description

STRATIX® IV E Field Programmable Gate Array (FPGA) IC 976 28033024 531200 1517-BBGA, FCBGA

Quantity 1,064 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-HBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O976Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28033024

Overview of EP4SE530H40C2 – STRATIX® IV E FPGA, 531,200 Logic Elements

The EP4SE530H40C2 is a STRATIX® IV E field-programmable gate array (FPGA) in a 1517-BBGA FCBGA package, offering a high-density programmable fabric for demanding logic and system integration tasks. As a member of the Stratix IV family, the device provides architecture features such as high-speed transceiver support, extensive embedded memory, DSP resources and flexible I/O suitable for high-bandwidth, protocol-rich applications.

With 531,200 logic elements, approximately 28 Mbits of on-chip RAM, and up to 976 I/Os, this commercial-grade FPGA is positioned for advanced communications, networking, data-acceleration and high-density signal processing designs that require high integration and configurable system-level functionality.

Key Features

  • Logic Capacity — 531,200 logic elements suitable for large, complex designs and high-density implementation of custom logic and control functions.
  • Embedded Memory — Total on-chip RAM of 28,033,024 bits (approximately 28 Mbits) to support buffers, large state machines and memory-intensive functions.
  • I/O Density — Up to 976 I/Os to accommodate broad connectivity and multiple external interface lanes.
  • High-Speed Architecture Features — Stratix IV series architecture includes high-speed transceiver and data-bandwidth features indicated in the device handbook for protocol-rich and high-throughput designs.
  • DSP and System Resources — Family documentation lists dedicated DSP blocks and clocking resources (PLLs and clock networks) that support signal processing and synchronous system designs.
  • Power and Supply — Core voltage supply range of 870 mV to 930 mV that defines power-supply requirements for the FPGA core.
  • Package & Mounting — 1517-BBGA, FCBGA package with supplier package reference 1517-HBGA (42.5 × 42.5 mm); surface-mount device for standard PCB assembly.
  • Commercial Grade & Temperature Range — Rated for commercial operation from 0 °C to 85 °C.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • High-speed networking and communications — Use the device’s high I/O count and Stratix IV family transceiver and bandwidth features to implement protocol engines and packet processing.
  • Data acceleration and signal processing — Large logic capacity and on-chip RAM support complex DSP pipelines and accelerator functions.
  • External memory controller and interface — On-chip resources and I/O density enable implementation of external memory interfaces and buffering logic.
  • High-density embedded systems — Integrate multiple system functions on a single FPGA to reduce board-level complexity and support configurable system designs.

Unique Advantages

  • High integration density: 531,200 logic elements and approximately 28 Mbits of embedded memory allow consolidation of large designs into a single device, reducing BOM and interconnect complexity.
  • Extensive I/O support: Up to 976 I/Os provide flexibility to connect multiple external interfaces, lanes and memory buses without additional bridging components.
  • Family-level high-speed features: Stratix IV device handbook highlights transceiver, clocking and high aggregate bandwidth capabilities that support protocol-rich and throughput-centric designs.
  • Surface-mount FCBGA package: 1517-BBGA/1517-HBGA (42.5 × 42.5 mm) packaging supports compact board layouts while accommodating the device’s pin count and thermal needs.
  • Commercial temperature rating: Rated 0 °C to 85 °C for use in standard commercial applications where this operating range is appropriate.
  • Regulatory compliance: RoHS compliance supports environmental requirements for lead-free manufacturing.

Why Choose EP4SE530H40C2?

The EP4SE530H40C2 combines the Stratix IV E family’s architecture-level features with a very large logic resource pool and substantial embedded memory, making it well suited for designers who need to implement high-density logic, memory buffering and complex protocol handling in a single FPGA. Its package options and high I/O count enable compact system integration while supporting multiple external interfaces.

This device is a practical choice for teams developing high-bandwidth communications, data-acceleration and signal-processing systems that require the integration of substantial logic and memory resources with robust clocking and transceiver-capable architecture as described in the Stratix IV device handbook.

Request a quote or submit an inquiry to receive pricing, availability and additional technical support for EP4SE530H40C2.

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