EP4SE530F43C2N

The EP4SE530F43C2N is a Stratix IV E field-programmable gate array provided in a 1760‑FCBGA package. It delivers a large programmable fabric with 531,200 logic elements and substantial embedded memory to support complex, high‑density designs.

Targeted at high‑performance systems, this device is suitable for applications that require extensive I/O, on‑chip memory and configurable logic. The device parameters and Stratix IV E device family features (as documented in the device handbook) support uses such as high‑bandwidth communications, signal processing and advanced system integration.

Key Features

• Core Capacity — 531,200 logic elements provide a high logic density for complex digital designs and large‑scale integration.
• Embedded Memory — Approximately 28.0 Mbits of on‑chip RAM (28,033,024 total RAM bits) for buffering, large lookup tables and on‑chip data storage.
• I/O Density — 1,120 dedicated I/O pins to support wide external interface connectivity and parallel subsystem integration.
• Stratix IV E Family Capabilities — Device handbook references include architecture features such as embedded memory, DSP blocks, PLLs, clock networks and high‑speed differential I/O with DPA and Soft‑CDR, enabling protocol and bandwidth‑oriented designs.
• Package & Mounting — 1760‑FCBGA (42.5 × 42.5 mm) surface‑mount package (1760‑BBGA, FCBGA) for high‑density PCB implementations.
• Power Supply — Core voltage range of 870 mV to 930 mV to match system power architecture requirements.
• Operating Range — Commercial grade operation from 0 °C to 85 °C.
• RoHS Compliant — Device is RoHS compliant for environmental and regulatory alignment.

Typical Applications

• High‑speed communications and networking — Use the device’s high logic capacity, on‑chip memory and Stratix IV E transceiver/I/O features to implement packet processing, protocol handling and bandwidth‑intensive interfaces.
• Digital signal processing — Leverage the large logic fabric and approximately 28 Mbits of embedded memory for DSP pipelines, filtering and real‑time data manipulation.
• External memory controller and bridging — The combination of abundant logic and 1,120 I/O pins supports custom external memory interfaces and bridging functions between subsystems.
• System integration and prototyping — High logic and I/O density make the device suitable for consolidating multiple functions into a single FPGA for evaluation and final system designs.

Unique Advantages

• High logic capacity: 531,200 logic elements enable integration of large, multi‑function designs and consolidation of discrete components.
• Substantial on‑chip memory: Approximately 28 Mbits of embedded RAM reduces external memory dependence and supports large buffers and tables on‑chip.
• Extensive I/O support: 1,120 I/Os provide flexibility for parallel interfaces, high‑pin‑count peripherals and complex board topologies.
• High‑density package: 1760‑FCBGA (42.5 × 42.5 mm) surface‑mount packaging delivers a compact solution for high‑pin‑count FPGA implementations.
• Power‑scoped core: Core supply range of 870 mV–930 mV allows integration into modern low‑voltage power architectures.
• Commercial operating range and compliance: Rated for 0 °C–85 °C operation and RoHS compliant to meet common commercial product requirements.

Why Choose EP4SE530F43C2N?

The EP4SE530F43C2N positions itself as a high‑capacity Stratix IV E FPGA suitable for designs that demand large programmable logic, significant embedded memory and broad I/O. Its combination of 531,200 logic elements, approximately 28 Mbits of on‑chip RAM and 1,120 I/Os supports consolidation of complex functions and implementation of high‑bandwidth subsystems.

This device is well suited for engineering teams building commercial‑grade communications, signal processing and system integration products who need a scalable, well‑documented FPGA family with comprehensive architecture features as outlined in the Stratix IV device handbook.

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