EP4SE530F43C2

The EP4SE530F43C2 is a STRATIX IV E series FPGA from Intel, delivering a high-density programmable fabric targeted at complex logic and system integration tasks. The device combines a large logic capacity with significant on-chip RAM and extensive I/O to address designs that require high channel counts, dense processing, and flexible I/O routing.

With 531,200 logic elements, approximately 28 Mbits of embedded memory, and 1,120 I/Os in a 1760‑FCBGA package, this commercial‑grade FPGA is intended for applications that demand high integration, configurable interfaces, and scalable logic resources.

Key Features

• Logic Capacity — 531,200 logic elements provide substantial programmable fabric for implementing complex state machines, data paths, and custom accelerators.
• Embedded Memory — Approximately 28 Mbits of on-chip RAM for buffering, FIFOs, and on‑chip data storage to support high-throughput designs.
• I/O Density — 1,120 user I/Os for broad external connectivity, enabling multiple parallel interfaces or high pin-count memory and peripheral connections.
• Package — 1760‑FCBGA (42.5 × 42.5 mm) package for high-density board integration and routing of numerous I/O signals.
• Core Power Supply — Core voltage range 0.87 V to 0.93 V, enabling designs that require defined low‑voltage core operation.
• Operating Grade and Temperature — Commercial grade with an operating temperature range of 0 °C to 85 °C, suitable for standard commercial applications.
• Series Architecture — Part of the STRATIX IV E device family, which includes architecture elements such as DSP blocks, PLLs, clock networks, and high‑speed I/O features documented in the device handbook.
• Environmental Compliance — RoHS compliant, meeting common environmental material requirements.

Typical Applications

• High‑density compute modules — Use the large logic array and embedded memory to implement parallel processing engines, custom accelerators, and complex control logic.
• High‑channel I/O systems — Leverage 1,120 I/Os for multi‑lane interfaces, wide external memory buses, or extensive peripheral connectivity.
• Signal processing and DSP — Utilize the device family’s DSP block and on‑chip RAM resources for real‑time filtering, aggregation, and numeric processing tasks.
• Memory interface controllers — Implement external memory controllers and buffering logic using the available logic elements and embedded RAM.

Unique Advantages

• High logic density: 531,200 logic elements provide headroom for complex designs without immediate need to partition across multiple devices.
• Substantial on‑chip RAM: Approximately 28 Mbits of embedded memory reduces dependence on external RAM for many buffering and scratch‑pad needs, simplifying board BOM.
• Extensive I/O count: 1,120 I/Os allow direct connection to multiple peripherals and wide external interfaces, minimizing additional bridge logic.
• Compact, serviceable package: 1760‑FCBGA (42.5 × 42.5 mm) offers a balance of pin count and board area for high‑density system designs.
• Defined core power window: 0.87–0.93 V core supply specification helps designers plan power delivery networks and thermal budgets precisely.
• Commercial readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product deployments.

Why Choose EP4SE530F43C2?

The EP4SE530F43C2 positions itself as a high‑capacity, highly configurable FPGA option within the STRATIX IV E family, combining large logic resources, significant embedded memory, and a very high I/O count in a single package. It is suited to system designers who need to consolidate complex logic, interface-heavy functions, and on‑chip buffering into a single device footprint.

For commercial applications requiring scalable logic, extensive I/O, and clear power and temperature specifications, this device provides a verifiable platform that aligns with system integration and performance‑oriented design goals. Its inclusion in the STRATIX IV E device family also provides access to documented architecture features such as DSP blocks, PLLs, and advanced clocking described in the device handbook.

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