EP4SE360H29I4G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 1,942 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-HBGA (33x33) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 488 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14144 | Number of Logic Elements/Cells | 353600 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 23105536 |
Overview of EP4SE360H29I4G – Field Programmable Gate Array (FPGA) IC
The EP4SE360H29I4G is an Intel Stratix IV–family FPGA presented in a high-density FCBGA package. It delivers a large logic fabric and substantial on-chip memory for designs that require programmable logic, extensive I/O, and deterministic operation across a wide temperature range.
Designed for industrial applications, the device combines 353,600 logic elements, approximately 23 Mbits of embedded memory, and 488 I/O pins to support complex system integration, protocol handling, and data aggregation in demanding environments.
Key Features
- Core Logic 353,600 logic elements provide a high-density reprogrammable fabric for complex digital designs and custom processing pipelines.
- Embedded Memory Approximately 23 Mbits of on-chip RAM for buffering, lookup tables, and deep packet or frame processing without immediate external memory dependence.
- I/O and System Interfaces 488 I/O pins support broad connectivity and external peripheral interfacing for multi-channel systems and protocol bridging.
- Family-Level Capabilities Stratix IV family features such as high-speed transceivers, DSP blocks, PLLs, and external memory interface support are documented in the Stratix IV device handbook and align with high-throughput and signal-processing use cases.
- Package and Mounting Available in 780-ball BGA packages (FCBGA / 780-BBGA and supplier package 780-HBGA 33×33), designed for surface-mount assembly to fit compact system boards.
- Power Core supply range specified between 0.870 V and 0.930 V to match system power-rail planning and regulators for the device core.
- Industrial Operating Range Rated for industrial operation from -40 °C to 100 °C for use in temperature-challenging deployments.
- Environmental Compliance RoHS compliant to meet common environmental and manufacturing requirements.
Typical Applications
- High‑speed communications Implement protocol stacks, aggregation, and protocol conversion using the Stratix IV family’s high‑speed transceiver and large logic fabric.
- Digital signal processing Leverage embedded memory and documented DSP block capabilities for real‑time filtering, FFTs, and media processing pipelines.
- Interface bridging and aggregation Use abundant I/O and on‑chip logic to consolidate multiple peripheral or sensor interfaces and implement custom protocol adaptors.
- Industrial control and automation Industrial temperature rating and surface‑mount BGA packaging make the device suitable for embedded controllers, motion control, and factory automation systems.
Unique Advantages
- High logic density: 353,600 logic elements enable large-scale integration of custom logic, reducing the need for multiple discrete controllers.
- Substantial on‑chip memory: Approximately 23 Mbits of embedded RAM supports buffering and local data processing, lowering external memory dependence.
- Broad I/O capability: 488 I/O pins provide design flexibility for multi-channel interfaces and complex board-level routing.
- Industrial‑grade thermal range: Rated from -40 °C to 100 °C for deployment in environments with wide temperature swings.
- Low‑voltage core operation: Core supply specified at 0.870–0.930 V supports modern power‑efficient system designs and regulator selection.
- Comprehensive family documentation: Stratix IV device handbook coverage of transceivers, DSP resources, PLLs, and I/O features aids development and validation.
Why Choose EP4SE360H29I4G?
The EP4SE360H29I4G positions itself as a high‑density, industrial‑grade FPGA suitable for systems that demand large programmable logic capacity, significant embedded memory, and extensive I/O. Its combination of 353,600 logic elements, approximately 23 Mbits of on‑chip RAM, and 488 I/Os provides the building blocks for complex communication, signal processing, and control applications.
This device is appropriate for engineering teams building scalable, long‑lived embedded platforms that require documented Stratix IV family features and industrial temperature support. The available BGA packages and RoHS compliance simplify board-level integration and manufacturing planning.
Request a quote or submit a pricing and availability inquiry to begin specifying EP4SE360H29I4G for your next design.

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