EP4SE360H29I3G

The EP4SE360H29I3G is an Intel FPGA device from the Stratix IV family, delivered in a 780-pin BGA package for surface-mount applications. It provides a high-density, reprogrammable logic fabric suitable for designs that require significant logic capacity, embedded memory, and broad I/O connectivity.

With 353,600 logic elements and approximately 23.1 Mbits of embedded memory, this industrial-grade FPGA targets compute- and I/O-intensive applications where performance, integration density, and extended temperature operation are important.

Key Features

• Logic Capacity — 353,600 logic elements for implementing large, complex digital designs and custom processing pipelines.
• Embedded Memory — Approximately 23.1 Mbits of on-chip RAM to support buffering, frame storage, and memory-intensive algorithms.
• I/O Density — 488 I/O pins to support wide external interfacing, multi-channel data throughput, and complex board-level integration.
• Power Supply — Core supply range from 870 mV to 930 mV to match system power design constraints.
• Package and Mounting — 780-HBGA (33×33) supplier package; 780-BBGA / FCBGA package case; surface-mount mounting for compact PCB designs.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in thermally demanding environments.
• Compliance — RoHS compliant.
• Stratix IV Architecture Features — Series documentation highlights architecture elements such as high-speed transceiver support, DSP blocks, PLLs, and extensive clock networks as part of the Stratix IV device family.

Typical Applications

• Communications and Networking — Implement protocol engines, packet processing, and high-aggregate bandwidth interfaces using the device’s large logic and I/O resources.
• Digital Signal Processing — Support DSP pipelines and streaming data applications leveraging abundant logic elements and on-chip memory.
• Industrial Control and Automation — Use in control systems that require industrial-grade temperature operation and high I/O counts for sensor and actuator interfacing.
• High-density I/O Bridging — Serve as a programmable bridge or aggregator for multiple parallel interfaces and custom board-level functions.

Unique Advantages

• High Logic Integration: 353,600 logic elements reduce the need for multiple devices and simplify board-level design.
• Substantial On-chip Memory: Approximately 23.1 Mbits of embedded RAM enable large buffers and local data storage, improving system throughput.
• Extensive External Connectivity: 488 I/O pins provide flexibility for multi-channel interfaces and complex peripheral integration.
• Industrial-grade Operation: −40 °C to 100 °C operating range supports deployment in robust and temperature-challenging environments.
• Compact Surface-mount Package: 780-HBGA (33×33) package balances pin count with PCB area for high-density designs.
• Standards-ready Manufacturing: RoHS compliance aligns with modern production and environmental requirements.

Why Choose EP4SE360H29I3G?

The EP4SE360H29I3G positions itself as a high-density, industrial-grade Stratix IV FPGA offering substantial logic capacity, embedded memory, and a large I/O complement. It is suited for engineers building compute- and I/O-heavy systems that demand on-chip resources and extended temperature operation.

Designers and procurement teams benefit from a device that consolidates complex functions into a single surface-mount package, simplifying BOM and PCB layout while providing the scalability and architecture features documented for the Stratix IV device family.

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