EP4SE360H29I3N

The EP4SE360H29I3N is an Intel Stratix IV E series FPGA in a 780-ball FCBGA package, designed for high-density digital logic and system integration. It combines a large logic fabric with on-chip memory, transceiver-capable I/O architecture, and device-level features documented in the Stratix IV device handbook.

Targeted at industrial applications, the device supports complex signal processing, high-bandwidth interfaces, and flexible system integration through its on-chip resources and broad I/O count.

Key Features

• Core Logic 353,600 logic elements provide extensive programmable logic capacity for complex designs and large FPGA implementations.
• Embedded Memory Approximately 23 Mbits of on-chip RAM support buffering, packet memory, and local data storage for compute and signal-processing tasks.
• I/O and Transceivers 488 user I/Os enable a wide range of external interfacing. The Stratix IV E family includes high-speed transceiver and differential I/O features as described in the device handbook.
• DSP and Timing Resources Architecture includes documented digital signal processing (DSP) blocks, PLLs and clock network features to support synchronous, high-performance designs.
• Power and Voltage Supported core supply range of 870 mV to 930 mV for the device core voltage domain.
• Package and Mounting 780-BBGA FCBGA package (supplier device package: 780-HBGA, 33×33 mm) designed for surface-mount assembly.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Compliance RoHS compliant.

Typical Applications

• High-speed communications and networking — Leverages the device’s documented high-speed transceiver and wide I/O count for protocol support and data-plane processing.
• Digital signal processing — On-chip DSP blocks and approximately 23 Mbits of embedded RAM enable filtering, transforms, and real-time data manipulation.
• External memory interface systems — Architecture and I/O resources support high-throughput external memory interfaces described in the device handbook.
• System integration and prototyping — Large logic capacity and comprehensive clock/PLL resources facilitate integration of complex subsystems on a single device.

Unique Advantages

• High logic density: 353,600 logic elements provide room for large, consolidated designs and reduce the need for multiple devices.
• Substantial on-chip RAM: Approximately 23 Mbits of embedded memory reduces external memory dependence for many buffering and storage functions.
• Extensive I/O resources: 488 I/Os support broad peripheral and interface connectivity without sacrificing logic resources.
• Industrial operating range: −40 °C to 100 °C rating supports deployment in industrial environments requiring extended temperature tolerance.
• Surface-mount BGA package: 780-ball FCBGA (33×33 mm) provides a compact, manufacturable form factor for production assemblies.
• Standards-aligned design documentation: Device features such as transceivers, DSP blocks, PLLs, and clock networks are documented in the Stratix IV device handbook for engineering reference.

Why Choose EP4SE360H29I3N?

The EP4SE360H29I3N positions itself as a high-capacity Stratix IV E FPGA option for engineers who need dense logic resources, significant embedded memory, and extensive I/O in an industrial-temperature, surface-mount package. Its combination of core logic, DSP resources, and documented transceiver/I/O features supports complex signal-processing and high-throughput interface designs.

This device is suited for teams designing industrial communications, advanced signal-processing systems, and integrated prototypes where logic density, on-chip memory, and a robust temperature range matter. The Stratix IV device handbook provides detailed architectural and implementation guidance to support system development.

Request a quote or submit an inquiry to receive pricing and availability for the EP4SE360H29I3N or to discuss specific volume and delivery requirements.