EP4SE360H29C4

The EP4SE360H29C4 is a STRATIX® IV E Field Programmable Gate Array (FPGA) provided in a 780-BBGA FCBGA package. It delivers a very large logic fabric with substantial on-chip memory and a high I/O count for complex digital designs.

With 353,600 logic elements, approximately 23.1 Mbits of embedded memory and 488 I/O, this commercial-grade FPGA is suitable for designs that require dense logic integration, significant embedded RAM capacity and extensive external interfacing within a surface-mount BGA footprint.

Key Features

• Core  STRATIX® IV E architecture implemented with 353,600 logic elements to support complex logic integration and large-scale designs.
• Embedded Memory  Approximately 23.1 Mbits of on-chip RAM for buffering, data storage and local processing needs.
• I/O Capacity  488 available I/O pins to support multiple external interfaces and parallel connectivity requirements.
• Power  Specified supply voltage range from 870 mV to 930 mV for core operation.
• Package & Mounting  Surface-mount 780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33).
• Operating Conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS-compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density logic integration  Use where large numbers of logic elements are required to implement complex algorithms and custom digital functions.
• On-chip buffering and data processing  Ideal for designs needing significant embedded memory for packet buffering, frame storage or local scratch memory.
• I/O-rich system interfaces  Suited to applications that consolidate multiple external interfaces or require parallel connectivity across many signals.
• System prototyping and integration  A surface-mount BGA package and commercial temperature range make it appropriate for board-level prototypes and production systems in commercial environments.

Unique Advantages

• Highly scalable logic capacity: 353,600 logic elements provide the headroom to implement large-scale, multi-function designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 23.1 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O availability: 488 I/O pins allow flexible interfacing and support for multiple simultaneous external connections.
• Compact BGA package: The 780-BBGA (FCBGA) footprint with supplier 780-HBGA (33×33) packaging enables high-density board layouts while keeping the device surface-mount compatible.
• Low-voltage core operation: Core supply range of 870 mV–930 mV supports designs optimized for modern low-voltage systems.
• Commercial-grade availability: Rated for 0 °C to 85 °C operation and RoHS compliance for use in standard commercial applications.

Why Choose EP4SE360H29C4?

The EP4SE360H29C4 delivers a combination of very high logic density, significant embedded memory and a large I/O count in a surface-mount BGA package, making it appropriate for commercial designs that demand compact integration of complex digital functionality. Its electrical and thermal specifications support system designs that emphasize on-chip resources and extensive external interfacing.

This part is well suited to engineering teams and procurement groups building commercial-grade systems that require scalable logic capacity, on-chip memory for local processing, and a compact package for board-level integration.

Request a quote or submit an inquiry to our sales team for pricing, availability and lead-time information for EP4SE360H29C4.