EP4SE360H29C3N

The EP4SE360H29C3N is a STRATIX® IV E Field Programmable Gate Array (FPGA) in a 780-BBGA (FCBGA) surface-mount package. It delivers a large fabric with 353,600 logic elements and approximately 23 Mbits of embedded memory, along with 488 general-purpose I/O pins for high-density system integration.

Designed as a commercial-grade device, the part operates from a core supply of 870 mV to 930 mV and across an operating temperature range of 0 °C to 85 °C. The device targets designs that require substantial on-chip logic, memory, and I/O capacity within a compact BGA footprint.

Key Features

• Core Architecture — STRATIX IV E Built on the Stratix IV E device family architecture with a large logic fabric suitable for complex FPGA designs.
• Logic Capacity 353,600 logic elements to implement large-scale digital logic and control functions on-chip.
• Embedded Memory Approximately 23 Mbits of on-chip RAM for buffering, storage, and embedded data structures.
• I/O Density 488 I/O pins to support extensive peripheral, interface, and memory connectivity.
• Power Supply Core supply range from 870 mV to 930 mV to match platform power requirements.
• Package and Mounting 780-BBGA (FCBGA) surface-mount package—Supplier device package: 780-HBGA (33×33)—for compact board-level integration.
• Operating Conditions Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance RoHS-compliant manufacturing for regulatory and environmental considerations.
• Family Features (from device handbook) The Stratix IV E family includes features such as DSP blocks, PLLs, clock networks, external memory interfaces, and high-speed transceiver capabilities noted in the device handbook for the family.

Typical Applications

• High‑density logic systems Use the device’s 353,600 logic elements and large on-chip RAM to consolidate complex control and processing functions on a single FPGA.
• Interface and I/O aggregation Leverage 488 I/O pins to interface with multiple peripherals, memory devices, and system buses in compact designs.
• Signal processing and DSP tasks Deploy embedded memory and the family’s DSP resources to implement buffering and on-chip signal-processing pipelines.
• External memory controller integration Implement external memory interfaces using the device’s dense logic and I/O resources to support system memory requirements.

Unique Advantages

• High on‑chip capacity: 353,600 logic elements and approximately 23 Mbits of embedded memory reduce dependence on external logic and RAM, simplifying system BOM.
• Extensive I/O: 488 I/O pins provide flexibility for multi-interface designs and high pin-count memory or peripheral connections.
• Compact BGA package: The 780-BBGA (33×33) FCBGA package enables a compact board layout while supporting high connectivity.
• Commercial-grade thermal range: Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial electronic applications.
• RoHS compliance: Environmentally compliant manufacturing supports regulatory requirements for many product lines.
• Designed within the Stratix IV E family: Family-level features such as PLLs, clock networks, DSP blocks, and high-speed transceiver capability support complex, protocol-rich system designs.

Why Choose EP4SE360H29C3N?

The EP4SE360H29C3N positions itself as a high-capacity Stratix IV E FPGA option for engineers who need substantial logic, embedded memory, and I/O in a single commercial-grade BGA package. Its combination of 353,600 logic elements, approximately 23 Mbits of on-chip RAM, and 488 I/Os makes it well-suited to consolidate complex digital functions and high‑connectivity interfaces on a single device.

This device is appropriate for teams designing systems that require large on-chip resources and compact board-level packaging, offering a balance of integration, predictable operating conditions (0 °C to 85 °C), and RoHS compliance for supply-chain and environmental considerations.

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