EP4SE360H29C2G

The EP4SE360H29C2G is an Intel FPGA device from the Stratix IV family, designed for high-capacity, system-level programmable logic. It provides a substantial logic fabric and on-chip memory to support compute- and I/O-intensive designs that require flexible, reprogrammable hardware.

With hundreds of I/Os, a compact 780-ball FCBGA package, and a defined commercial operating range, this device targets applications that demand high integration, scalable logic resources, and dependable board-level implementation.

Key Features

• Logic Capacity — 353,600 logic elements for implementing complex digital designs and large custom architectures.
• Embedded Memory — approximately 23.1 Mbits of on-chip RAM for buffering, tables, and local data storage.
• I/O Density — 488 I/O pins to support broad interfacing with peripherals, memory, and high-pin-count board designs.
• Package and Mounting — 780-ball BBGA/FCBGA package (supplier package: 780-HBGA, 33×33 mm) with surface-mount mounting for compact, board-level deployment.
• Power — Core supply voltage range specified at 870 mV to 930 mV to match system power delivery design.
• Operating Range — Commercial-grade temperature rating from 0 °C to 85 °C suitable for standard commercial environments.
• Environmental Compliance — RoHS compliant for global electronic manufacturing requirements.

Typical Applications

• High-bandwidth communications — Use the device’s large logic capacity and extensive I/O to implement protocol engines, packet processing, and interface bridging.
• Signal processing and acceleration — On-chip memory and abundant logic elements support buffering and custom datapaths for DSP-like workloads.
• System integration and prototyping — High I/O count and dense logic enable consolidation of multiple functions into a single programmable device for system prototypes and production consolidations.

Unique Advantages

• High logic density: 353,600 logic elements provide headroom for large-scale designs and consolidation of multiple functions into one device.
• Significant on-chip memory: Approximately 23.1 Mbits of embedded RAM reduces dependency on external memory for many buffering and lookup tasks.
• Extensive interfacing capability: 488 I/Os permit flexible connectivity to peripherals, memory interfaces, and multi-lane external links.
• Compact, board-ready package: 780-ball FCBGA (33×33 mm) surface-mount package supports dense PCBs while keeping the solution integrated.
• Defined electrical and thermal envelope: Specified core voltage and commercial temperature range simplify system power and thermal planning.
• Regulatory readiness: RoHS compliance supports mainstream manufacturing and deployment requirements.

Why Choose EP4SE360H29C2G?

The EP4SE360H29C2G combines a large logic fabric, substantial embedded memory, and a high I/O count in a compact FCBGA package, making it a practical choice for engineers needing a programmable, high-capacity device for communications, signal processing, and system integration tasks. Its defined supply voltage range and commercial operating window allow straightforward integration into standard board designs.

This device is well suited to teams and projects that require scalable, reprogrammable hardware with measurable on-chip resources and clear package specifications, enabling predictable BOM planning and deployment in commercial applications.

Request a quote or submit an inquiry for pricing and availability to evaluate EP4SE360H29C2G for your next design.