EP4SE530F43C2G

IC FPGA 1120 I/O 1760FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 189 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O1120Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits28033024

Overview of EP4SE530F43C2G – Field Programmable Gate Array (FPGA) IC

The EP4SE530F43C2G is an Intel Stratix IV family FPGA offering a high-density programmable fabric for complex digital designs. It combines a large number of logic elements, substantial on‑chip memory, and extensive I/O to support high‑bandwidth signal processing and system integration tasks.

This device targets commercial applications requiring significant logic capacity, abundant embedded memory, and flexible I/O connectivity while operating within standard commercial temperature and power envelopes.

Key Features

  • Core Logic  531,200 logic elements provide a sizeable programmable fabric for implementing complex digital functions and custom accelerators.
  • Embedded Memory  Approximately 28 Mbits of on‑chip RAM (28,033,024 total RAM bits) to support buffering, lookup tables, and local data storage.
  • I/O Capacity  1,120 user I/O pins to enable broad interfacing options with peripherals, memory, and high‑speed links.
  • Architecture and System Features  Device handbook references show Stratix IV architecture features such as high‑speed transceiver support, DSP blocks, PLLs, and flexible clock networks for system integration and high‑throughput designs.
  • Power  Core voltage supply range specified at 870 mV to 930 mV to match platform power requirements.
  • Package & Mounting  1760‑ball FCBGA (1760‑BBGA) package, 42.5 mm × 42.5 mm; surface‑mount mounting for board‑level integration.
  • Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

  • High‑bandwidth communications  Suitable for systems that require high aggregate data bandwidth and high‑speed serial interfaces as supported by Stratix IV architecture features.
  • Digital signal processing  Large logic capacity and embedded memory enable implementation of DSP pipelines, filtering, and real‑time processing blocks.
  • System integration and prototyping  Dense I/O and flexible clocking make the device useful for integrating multiple subsystems and for platform prototyping.
  • External memory interfacing  Architecture references to external memory interfaces make the device suitable for designs that require on‑board DRAM or other external memory connectivity.

Unique Advantages

  • High logic density: 531,200 logic elements provide room for large, complex designs and hardware accelerators without external logic.
  • Significant on‑chip RAM: Approximately 28 Mbits of embedded memory reduces dependence on external buffering for many designs.
  • Extensive I/O count: 1,120 I/O pins enable broad peripheral connectivity and multi‑channel interfaces on a single device.
  • System‑level features: Stratix IV family architecture includes high‑speed transceiver capabilities, DSP resources, and flexible clocking to support demanding data paths.
  • Compact board integration: 1760‑ball FCBGA (42.5 × 42.5 mm) surface‑mount package supports high‑density PCB layouts.
  • Commercial temperature and RoHS compliant: Rated 0 °C to 85 °C and RoHS compliant for standard commercial deployments.

Why Choose EP4SE530F43C2G?

EP4SE530F43C2G combines a large programmable fabric, substantial embedded memory, and wide I/O availability within the Stratix IV family architecture, making it well suited for commercial designs that demand high logic capacity and robust system integration features. Its documented architecture elements—such as support for high‑speed transceivers, DSP blocks, and flexible clock networks—help engineers implement high‑throughput, tightly integrated systems.

This device is appropriate for development teams and OEMs building high‑performance communications, signal processing, and system‑integration products who need a commercially graded FPGA platform with clear electrical and thermal envelopes and RoHS compliance.

Request a quote or submit a product inquiry to check availability, pricing, and lead times for EP4SE530F43C2G.

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