EP4SE360F35I3G

The EP4SE360F35I3G is a high-density Field Programmable Gate Array (FPGA) IC from Intel, based on the Stratix IV device family. It delivers a combination of large programmable logic capacity, substantial embedded memory, and broad I/O connectivity for demanding digital designs.

Designed for industrial-grade applications, this device targets systems that require extensive logic resources, significant on-chip RAM, and robust I/O counts while operating across a wide temperature range and low-voltage supply window.

Key Features

• Logic Capacity – 353,600 logic elements provide a large programmable fabric for complex custom logic and system integration.
• Embedded Memory – Approximately 23.1 Mbits of on-chip RAM to support large buffers, frame storage, and memory-intensive algorithms.
• I/O Count – 744 user I/Os enable extensive external connectivity for parallel interfaces, memory buses, and multi-lane transceiver endpoints.
• Device Architecture (Series-level) – Based on the Stratix IV device family architecture, which includes FPGA fabric, PLLs, DSP resources, and high-speed transceiver features documented in the device handbook.
• Package and Mounting – Available in a 1152-ball FCBGA (1152-FBGA, 35×35) package; surface-mount mounting type supports compact board-level integration.
• Power Supply – Operates from a core supply range of 870 mV to 930 mV, suitable for low-voltage, high-performance FPGA core operation.
• Industrial Temperature Grade – Rated for operation from −40°C to 100°C to meet industrial-environment requirements.
• RoHS Compliance – Manufactured in accordance with RoHS requirements.

Typical Applications

• High-Speed Networking & Telecom – Large logic capacity and extensive I/O enable implementation of protocol processing, packet handling, and interface bridging.
• Data Processing & Acceleration – Significant on-chip RAM and Stratix IV architecture elements support streaming data pipelines, buffering, and DSP-accelerated tasks.
• Industrial Control & Automation – Industrial-grade temperature range and robust I/O counts make the device suitable for control systems, high-channel I/O aggregation, and factory automation.
• Video & Imaging Systems – Substantial embedded memory and wide I/O complement video frame buffering, preprocessing, and multi-channel video interfacing.

Unique Advantages

• High Logic Density: 353,600 logic elements provide the capacity to consolidate multiple functions and reduce external component count.
• Large On-Chip Memory: Approximately 23.1 Mbits of embedded RAM supports deep buffering and data staging without relying on external DRAM.
• Extensive I/O Connectivity: 744 user I/Os allow flexible partitioning of parallel buses, high-pin-count peripherals, and multi-lane interfaces.
• Industrial Reliability: Rated for −40°C to 100°C operation, enabling deployment in temperature-challenging environments.
• Compact, Surface-Mount Package: 1152-ball FCBGA (35×35) package supports dense PCB layouts while providing the pin count needed for complex systems.
• Low-Voltage Core: Core supply range of 870 mV to 930 mV aligns with modern low-voltage FPGA power domains for efficient core operation.

Why Choose EP4SE360F35I3G?

The EP4SE360F35I3G positions itself as a high-density, industrial-grade Stratix IV FPGA offering a balance of programmable logic, embedded memory, and extensive I/O. Its specifications make it well suited for engineers building complex, integrated systems that require on-chip resources and wide external connectivity.

Customers designing communications, industrial control, data-acceleration, or imaging systems will find the device’s combination of logic elements, memory capacity, and temperature rating advantageous for scalable, reliable designs backed by Intel Stratix IV documentation.

Request a quote or submit an inquiry for pricing and availability to evaluate EP4SE360F35I3G for your next high-density FPGA design.