EP4SE360F35I3N

The EP4SE360F35I3N is an Intel STRATIX® IV E field programmable gate array (FPGA) in a high-density 1152‑FBGA (35×35) surface-mount package. It delivers substantial logic and I/O resources along with significant on-chip RAM to support complex, high-density digital designs.

With 353,600 logic elements, approximately 23.1 Mbits of embedded memory and 744 I/O pins, this device is suited to applications that require large logic capacity, extensive interfacing and operation across an industrial temperature range.

Key Features

• Core Logic — 353,600 logic elements provide large programmable logic capacity for complex digital functions and custom processing pipelines.
• Embedded Memory — Approximately 23.1 Mbits of on-chip RAM to support buffering, LUT-based storage and memory‑intensive logic without relying solely on external memory.
• High I/O Count — 744 I/O pins to accommodate dense peripheral connectivity and multi-channel interfaces directly on-chip.
• Package and Mounting — 1152‑FBGA (35×35) package, surface-mount for compact board-level integration and high‑density PCB layouts.
• Power Supply — Core voltage supply range of 870 mV to 930 mV to match system power design requirements.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for reliable use in industrial environments.

Typical Applications

• High-density digital processing — Leverage 353,600 logic elements for compute-intensive FPGA tasks and custom accelerators.
• Industrial control systems — Industrial temperature rating and robust package make the device suitable for automation and control applications.
• Multi-channel interfacing — 744 I/O pins enable extensive sensor, actuator and peripheral interfacing on a single device.
• Memory‑intensive embedded designs — Approximately 23.1 Mbits of on-chip RAM supports buffering, queuing and local storage demands without immediate dependence on external memory.

Unique Advantages

• High logic density: 353,600 logic elements provide the capacity to consolidate multiple functions into a single FPGA, simplifying system architecture.
• Significant on-chip memory: Approximately 23.1 Mbits of embedded RAM reduces external memory needs and improves data locality.
• Extensive I/O: 744 I/O pins enable direct connection to a wide range of peripherals and parallel interfaces, lowering the need for external multiplexing.
• Industrial temperature capability: Rated −40 °C to 100 °C for reliable operation in temperature‑sensitive deployments.
• Compact BGA footprint: 1152‑FBGA (35×35) surface-mount package supports dense PCB designs while enabling high pin counts.
• Tight core voltage range: 870 mV to 930 mV supply specification supports predictable power design and integration.

Why Choose EP4SE360F35I3N?

The EP4SE360F35I3N combines substantial programmable logic, large embedded memory and a high I/O count in a compact FBGA package, delivering a balanced platform for complex digital systems that require integration and robustness. Its industrial temperature rating and defined core voltage range support deployment in demanding environments where stability and predictable power behavior are important.

This device is well suited for design teams targeting high-density logic consolidation, systems with extensive interfacing needs, or applications that benefit from significant on-chip memory. The Intel STRATIX® IV E family positioning provides a clear path for designs that prioritize logic capacity, I/O flexibility and industrial-grade operation.

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