EP4SE360F35C3G

IC FPGA 744 I/O 1152FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 1,202 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs14144Number of Logic Elements/Cells353600
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits23105536

Overview of EP4SE360F35C3G – Field Programmable Gate Array (FPGA) IC

The EP4SE360F35C3G is a commercial-grade Field Programmable Gate Array from Intel, based on the Stratix IV device family architecture. It delivers a high logic capacity and abundant I/O to address complex signal-processing, high-speed interface, and system-integration tasks.

Designed for applications that require substantial on-chip resources and flexible I/O, this device combines a large number of logic elements, significant embedded memory, and device-level features such as clock networks, PLLs and high-speed transceiver capabilities described in the Stratix IV handbook.

Key Features

  • Core Logic Capacity  Provides 353,600 logic elements for implementing complex digital designs and large combinational/sequential logic networks.
  • Logic Array Blocks  Includes 14,144 logic array blocks to structure and distribute logic resources across the device.
  • Embedded Memory  Offers approximately 23 Mbits of on-chip RAM to support large buffers, FIFOs, and local data storage for high-throughput designs.
  • Rich I/O Count  744 I/O pins enable extensive external connectivity for multi-protocol interfaces and high fanout designs.
  • Stratix IV Family Features  Device handbook highlights architecture features such as high-speed transceiver support, DSP blocks, clock networks, PLLs, and system diagnostic and signal-integrity features.
  • Power and Supply  Core voltage supply range is specified at 870 mV to 930 mV to meet the device’s power domain requirements.
  • Package and Mounting  Available in a 1152-ball FCBGA package (1152-FBGA, 35×35) for surface-mount assembly, simplifying board-level integration for dense systems.
  • Operating Conditions  Commercial-grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant.

Typical Applications

  • High‑performance data processing  Large logic capacity and substantial embedded memory support complex algorithms, packet handling, and parallel processing pipelines.
  • High‑speed communications  Stratix IV family transceiver and I/O features combined with abundant I/O pins make the device suitable for protocol bridging and multi‑lane interfaces.
  • Signal processing and DSP acceleration  On-chip memory and architecture-level DSP support (as described in the device handbook) enable hardware acceleration for filtering, encoding, and real-time processing tasks.
  • System integration and interface aggregation  High I/O count and flexible fabric allow consolidation of multiple peripheral interfaces and memory controllers on a single device.

Unique Advantages

  • Large programmable fabric:  353,600 logic elements provide the headroom to implement complex state machines, custom accelerators, and wide datapaths without partitioning across multiple FPGAs.
  • Substantial on‑chip memory:  Approximately 23 Mbits of embedded RAM reduce external memory dependence for buffering and low-latency data storage.
  • High I/O density:  744 I/O pins simplify board routing and support numerous parallel interfaces, reducing the need for external multiplexing logic.
  • Stratix IV feature set:  Architecture-level items such as PLLs, clock networks, DSP blocks, and high‑speed transceiver capabilities (documented in the Stratix IV handbook) provide a proven platform for demanding designs.
  • Compact board footprint:  1152-ball FCBGA surface-mount package enables dense PCB layouts while maintaining high pin count accessibility.
  • Commercial readiness:  RoHS compliance and a defined 0 °C to 85 °C operating range support mainstream production and deployment environments.

Why Choose EP4SE360F35C3G?

The EP4SE360F35C3G positions itself as a high-capacity, commercially rated FPGA option within the Stratix IV family, combining a large programmable fabric, significant embedded memory, and extensive I/O to tackle complex logic and interface requirements. Its architecture-level features documented in the device handbook make it suitable for designs that need integrated DSP resources, clocking and transceiver capabilities.

This device is ideal for engineering teams building high-throughput data-paths, interface-aggregation solutions, or hardware-accelerated processing blocks that require scalable logic resources and robust on-chip memory. Choosing this part leverages documented Stratix IV family capabilities and Intel manufacturing pedigree for long-term design continuity.

Request a quote or contact sales to inquire about pricing, availability, and implementation support for EP4SE360F35C3G.

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