EP4SE360F35C3G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 1,202 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 744 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14144 | Number of Logic Elements/Cells | 353600 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 23105536 |
Overview of EP4SE360F35C3G – Field Programmable Gate Array (FPGA) IC
The EP4SE360F35C3G is a commercial-grade Field Programmable Gate Array from Intel, based on the Stratix IV device family architecture. It delivers a high logic capacity and abundant I/O to address complex signal-processing, high-speed interface, and system-integration tasks.
Designed for applications that require substantial on-chip resources and flexible I/O, this device combines a large number of logic elements, significant embedded memory, and device-level features such as clock networks, PLLs and high-speed transceiver capabilities described in the Stratix IV handbook.
Key Features
- Core Logic Capacity Provides 353,600 logic elements for implementing complex digital designs and large combinational/sequential logic networks.
- Logic Array Blocks Includes 14,144 logic array blocks to structure and distribute logic resources across the device.
- Embedded Memory Offers approximately 23 Mbits of on-chip RAM to support large buffers, FIFOs, and local data storage for high-throughput designs.
- Rich I/O Count 744 I/O pins enable extensive external connectivity for multi-protocol interfaces and high fanout designs.
- Stratix IV Family Features Device handbook highlights architecture features such as high-speed transceiver support, DSP blocks, clock networks, PLLs, and system diagnostic and signal-integrity features.
- Power and Supply Core voltage supply range is specified at 870 mV to 930 mV to meet the device’s power domain requirements.
- Package and Mounting Available in a 1152-ball FCBGA package (1152-FBGA, 35×35) for surface-mount assembly, simplifying board-level integration for dense systems.
- Operating Conditions Commercial-grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant.
Typical Applications
- High‑performance data processing Large logic capacity and substantial embedded memory support complex algorithms, packet handling, and parallel processing pipelines.
- High‑speed communications Stratix IV family transceiver and I/O features combined with abundant I/O pins make the device suitable for protocol bridging and multi‑lane interfaces.
- Signal processing and DSP acceleration On-chip memory and architecture-level DSP support (as described in the device handbook) enable hardware acceleration for filtering, encoding, and real-time processing tasks.
- System integration and interface aggregation High I/O count and flexible fabric allow consolidation of multiple peripheral interfaces and memory controllers on a single device.
Unique Advantages
- Large programmable fabric: 353,600 logic elements provide the headroom to implement complex state machines, custom accelerators, and wide datapaths without partitioning across multiple FPGAs.
- Substantial on‑chip memory: Approximately 23 Mbits of embedded RAM reduce external memory dependence for buffering and low-latency data storage.
- High I/O density: 744 I/O pins simplify board routing and support numerous parallel interfaces, reducing the need for external multiplexing logic.
- Stratix IV feature set: Architecture-level items such as PLLs, clock networks, DSP blocks, and high‑speed transceiver capabilities (documented in the Stratix IV handbook) provide a proven platform for demanding designs.
- Compact board footprint: 1152-ball FCBGA surface-mount package enables dense PCB layouts while maintaining high pin count accessibility.
- Commercial readiness: RoHS compliance and a defined 0 °C to 85 °C operating range support mainstream production and deployment environments.
Why Choose EP4SE360F35C3G?
The EP4SE360F35C3G positions itself as a high-capacity, commercially rated FPGA option within the Stratix IV family, combining a large programmable fabric, significant embedded memory, and extensive I/O to tackle complex logic and interface requirements. Its architecture-level features documented in the device handbook make it suitable for designs that need integrated DSP resources, clocking and transceiver capabilities.
This device is ideal for engineering teams building high-throughput data-paths, interface-aggregation solutions, or hardware-accelerated processing blocks that require scalable logic resources and robust on-chip memory. Choosing this part leverages documented Stratix IV family capabilities and Intel manufacturing pedigree for long-term design continuity.
Request a quote or contact sales to inquire about pricing, availability, and implementation support for EP4SE360F35C3G.

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