EP4SE360F35C3

The EP4SE360F35C3 is a STRATIX® IV E FPGA in a 1152-ball FCBGA package designed for commercial-grade, surface-mount applications. It delivers high logic density with 353,600 logic elements and approximately 23.1 Mbits of on-chip RAM, along with 744 user I/O pins for designs requiring extensive external interfacing.

Operating from a supply range of 870 mV–930 mV and specified for 0 °C to 85 °C, this device targets applications that require substantial programmable logic, embedded memory, and a high I/O count in a compact package.

Key Features

• Core Logic  353,600 logic elements provide a large fabric for implementing complex digital designs and parallel processing functions.
• Embedded Memory  Approximately 23.1 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive logic blocks.
• I/O Density  744 user I/O pins support extensive external interfacing and multi-channel connectivity.
• Power Supply  Designed for a core voltage supply range of 870 mV–930 mV to match system power requirements.
• Package & Mounting  1152-BBGA (FCBGA) 35×35 supplier device package in a surface-mount form factor for compact PCB implementations.
• Operating Range & Grade  Commercial-grade device with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
• Regulatory Status  RoHS compliant for use in lead-free manufacturing processes.

Typical Applications

• High-density I/O systems  744 I/O pins accommodate designs that require numerous external interfaces and signal channels.
• Large-scale programmable logic  The 353,600 logic elements enable complex digital functions, custom processors, and parallel datapaths.
• Memory-intensive designs  Approximately 23.1 Mbits of embedded memory support buffering and on-chip data storage for high-throughput logic.
• Compact board-level solutions  The 1152-ball FCBGA surface-mount package suits space-constrained PCBs that need high integration.

Unique Advantages

• High logic density: 353,600 logic elements allow consolidation of large amounts of functionality into a single FPGA, reducing overall system complexity.
• Substantial embedded memory: Approximately 23.1 Mbits of on-chip RAM reduce dependence on external memory for many buffering and data-path needs.
• Extensive I/O capability: 744 I/Os enable rich peripheral interfacing and multi-channel connectivity without immediate need for external I/O expanders.
• Compact FCBGA packaging: The 1152-ball FCBGA (35×35) package supports dense board layouts while providing a reliable surface-mount solution.
• Commercial temperature suitability: Rated 0 °C to 85 °C and RoHS compliant for standard commercial manufacturing and deployment.

Why Choose EP4SE360F35C3?

The EP4SE360F35C3 offers a combination of high logic element count, significant embedded RAM, and a large number of I/Os in a compact 1152-ball FCBGA package. This balance of capacity and integration makes it appropriate for commercial designs that require substantial programmable logic, on-chip memory, and extensive external interfacing within a surface-mount form factor.

For teams designing board-level systems that demand high integration and scalability within commercial operating conditions, the EP4SE360F35C3 provides a robust, RoHS-compliant option backed by the STRATIX IV E architecture's logic and memory resources.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the EP4SE360F35C3.