EP4SE360F35C2

The EP4SE360F35C2 is a STRATIX® IV E field programmable gate array (FPGA) manufactured by Intel. It delivers a high-density FPGA fabric with 353,600 logic elements, significant on-chip memory, and a large I/O complement for complex digital designs.

Targeted at commercial-grade applications, the device is supplied in a 1152-FBGA (35 × 35) surface-mount package and operates over a standard commercial temperature range.

Key Features

• Core and Logic  353,600 logic elements provide the programmable fabric required for large-scale digital designs.
• Embedded Memory  Approximately 23.1 Mbits of on-chip RAM (23,105,536 bits) for buffering, state storage, and local data processing.
• I/O Capacity  744 I/O pins support extensive interfacing and multiple external signal connections.
• Package  1152-FBGA (35 × 35) package case, surface-mount mounting type, suitable for high-density PCB implementations.
• Power  Core voltage supply range of 870 mV to 930 mV to match system power requirements.
• Temperature and Grade  Commercial grade operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS-compliant material declaration.

Typical Applications

• Custom digital logic implementation  Use the device’s 353,600 logic elements to realize complex state machines, signal processing pipelines, or custom accelerators.
• Memory-intensive functions  Approximately 23.1 Mbits of embedded RAM enable local buffering, packet buffering, and intermediate data storage without external memory for many designs.
• High-density I/O interfacing  With 744 I/Os the device can manage multiple external interfaces, sensors, and peripherals in a single FPGA solution.
• Compact board-level integration  The 1152-FBGA (35 × 35) surface-mount package supports space-constrained PCB layouts while maintaining high pin count.

Unique Advantages

• High logic capacity: 353,600 logic elements enable consolidation of large designs into a single FPGA, reducing board-level complexity.
• Substantial embedded memory: Approximately 23.1 Mbits of on-chip RAM supports data buffering and local storage to simplify external memory requirements.
• Extensive I/O resources: 744 I/Os provide flexibility for multi-interface systems and high-channel-count designs.
• Compact BGA footprint: 1152-FBGA (35 × 35) package balances pin density with manufacturability for surface-mount assembly.
• Commercial temperature rating: Rated 0 °C to 85 °C for standard commercial deployments.
• RoHS compliant: Conforms to RoHS requirements for material compliance.

Why Choose EP4SE360F35C2?

The EP4SE360F35C2 STRATIX IV E FPGA combines high logic density, meaningful on-chip memory, and a large I/O count in a compact surface-mount FBGA package. Its commercial temperature rating and RoHS-compliant construction make it suitable for a wide range of commercial electronic systems where integration density and interface capacity are important.

Manufactured by Intel, this FPGA is an optionset for engineers seeking a scalable, high-capacity programmable device to consolidate functions, reduce board-level complexity, and implement sophisticated digital architectures within a single package.

Request a quote or submit an RFQ for EP4SE360F35C2 to check pricing and availability for your next design project.